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SEMICON WEST 2004 FEATURES INDUSTRY KEYNOTES AND SPECIAL EVENTS Largest Semiconductor Manufacturing Event in North America to be held July 12-16 in San Francisco and San Jose |
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| SAN JOSE, Calif., June 24, 2004 -- SEMICON West 2004, the largest exposition
in North America devoted to semiconductor and related microelectronics
manufacturing, will feature keynote presentations by industry luminaries,
focused panel discussions among technology experts and other programs designed
to increase information exchange between the global IC community and their
manufacturing technology providers. SEMICON West keynote sessions are available at no cost to all exposition attendees and include addresses by Paolo Gargini of Intel; Steven Appleton of Micron; Aart de Geus of Synopsys and Bruce Freyman of Amkor (see editors' note for details on keynotes and special panel discussions). The 33rd annual SEMICON West opens at the Moscone Center with the Wafer Processing segment July 12-14, and continues at the San Jose Convention Center with the Final Manufacturing segment, July 14-16. During the week-long exposition, 1,500 exhibiting companies in 3,700 booths occupying more than 333,000 net square feet of exhibit space will showcase the latest equipment, materials, components and services to manufacture semiconductors, micro-electomechanical systems (MEMS) and related microelectronics technology. The exposition includes two special exhibit areas. The Technology Innovation Showcase (TIS) encompasses a display area and presentation forum for 27 selected companies that will feature new innovations for next generation semiconductor processing. The MEMS/NEMS Pavilion highlights 20 companies with critical enabling technologies for the MEMS and nanotechnology manufacturing sectors. In addition to product exhibits, SEMICON West 2004 will serve as a platform for key industry communications including the International Technology Roadmap for Semiconductors (ITRS) 2004 update, the Fab Managers Forum, SEMI Technology Symposiums, SEMI/Merrill Lynch Investor Forum, the SEMI Market Symposium, a Supply Chain Conference and SEMI International Standards meetings to further develop needed industry specifications. The keynote addresses, special panel discussions and SEMI/Merrill Lynch investor conference are located in special "Center Stage" venues sponsored by Agilent Technologies in both San Francisco and San Jose. The "Center Stage" events, TIS exhibits and presentations, MEMS/NEMS pavilion events and SEMI International Standards meetings are open to all attendees at no cost. “SEMICON West 2004 has been significantly redesigned to increase participation and provide much greater value for exposition attendees and exhibitors,” said Vicki Hadfield, president of SEMI North America. “The exposition has long been the industry's premier venue to see the latest technology products. The event now has expanded industry information and exposure to industry leaders." Twelve ITRS working groups will discuss roadmap issues relating to semiconductor manufacturing and will present their conclusions on July 14. These results will be published in November as the 2004 ITRS Update. For further information about participation in the ITRS sessions during SEMICON West, contact Linda Wilson, International SEMATECH at 512.356.3605 or technology.roadmap@sematech.org. The Fab Managers Forum, July 13, will address advance process control in the wafer fab and challenges in maximizing capital equipment efficiency. The forum is comprised of a series of short presentations from industry experts followed by breakout sessions where device makers and suppliers will address specific critical issues. The Fab Managers Forum is presented by SEMI with association partners International SEMATECH and the Semiconductor Industry Association (SIA). The event is sponsored by Invensys, KLA-Tencor, Mattson, SI Automation, SI2, HCL and International SEMATECH Manufacturing Initiative. The SEMI Market Symposium, July 13, is sponsored by Brewer Science and announces the SEMI midyear semiconductor equipment consensus forecast and provides a market update for the semiconductor, capital equipment and semiconductor materials industries. Discussion of procurement considerations and technology trends for the fab and final manufacturing sectors will also be reviewed. Featured speakers include: Jim Duckworth of Freescale Semiconductor, George Burns of Strategic Marketing Associates, Doug Andrey of the SIA, Rich Rice of ASE and SEMI analysts Dan Tracy and Lubab Sheet. The SEMI Technology Symposium (STS): Innovations in Semiconductor Manufacturing (ISM), will focus on practical solutions to problems associated with wafer fabrication and in particular, the 90 and 130-nanometer nodes. The STS:ISM will run July 12-14 in the Marriott Hotel, San Francisco. In San Jose the STS: International Electronics Manufacturing Technology (IEMT) program, from July 14-16, will focus on solutions to problems encountered in the final manufacturing of semiconductors. The SEMI/Merrill Lynch Global Securities Investment Conference, July 14, is an executive forum providing investment, technology and manufacturing perspectives in discussions with Merrrill Lynch analysts Joe Osha and Brett Hodess. Speakers include Dr. Jai Hakhu of Intel, Dr. Edward Ross of TSMC North America and Mark Durcan of Micron Technology. The speakers and moderators will also participate in a panel discussion with Ken Schroeder of KLA-Tencor and Rick Hill of Novellus. The Supply Chain Conference, July 14-15 in San Jose, is cosponsored by Lam Research and will feature two pre-conference tutorials focusing on the fundamentals of strategic cost management and business continuity plan development, a main session for all levels of supply chain practitioners and parallel tracks focusing on applications, tools and best practices. Guest speaker Chris Gopal, who is credited with implementing Dell Computer’s supply chain system, will address the conference on July 14. Standards development will be a key activity during SEMICON West 2004. More than 100 task forces will meet in the Marriott Hotel, San Francisco to discuss the draft documents in areas such as e-diagnostics, factory automation, material handling, silicon wafer, microlithography and MEMS. A new nanotechnology task force will meet for the first time to determine nano-particles and slurries standards requirements. In addition, five Standards Technical Education Programs (STEPs) will be conducted providing attendees with in-depth information about Standards implementation and application. For further information on SEMI standards activities during SEMICON West visit www.semi.org/standards For more information about SEMICON West 2004, visit the SEMICON West 2004 website at www.semi.org/semiconwest, or call SEMI Customer Service at 1.408.943.6901. Qualified journalists wishing to attend SEMICON West 2004 must pre-register for media accreditation. Contact Jennifer Blatt, SEMI Public Relations, at 1.408.943.7988 or jblatt@semi.org. SEMI is a global industry association for companies participating in the microelectronics and display industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org. ASSOCIATION CONTACTS: Jonathan Davis/SEMI Tel: 1.408.943.6937 E-mail: jdavis@semi.org About the Keynote Presentations and Panel Discussions Monday, July 12, 1:00-2:00 p.m. Moscone Center, Esplanade Hall, San Francisco Dr. Paolo A. Gargini, Intel Fellow, Technology and Manufacturing Group and Director, Technology Strategy, Intel Corporation, will provide a status review of the 2004 update to the International Technology Roadmap for Semiconductors (ITRS) on the opening day of SEMICON West. Dr. Gargini's address kicks-off the ITRS technical working group meetings and outlines for all expo participants the anticipated challenges and changes in the principle document that guides technology development on an industry-wide basis. Tuesday, July 13, 9:00-9:45 a.m. Moscone Center, Esplanade Hall, San Francisco Steven R. Appleton, Chairman, Chief Executive Officer and President, Micron Technology, will address the critical issues in semiconductor manufacturing fab management. The keynote addresses the Fab Management Forum theme, "Maximizing Profitability through Optimizing Productivity." Wednesday, July 14, 1:00-2:00 p.m. Moscone Center, Esplanade Hall, San Francisco Dr. Aart J. de Geus, Chairman of the Board and Chief Executive Officer, Synopsys, will present, "Design for Manufacturing: Hand in Hand, not Hand-offs." 130nm yield issues surprised all participants in the IC value chain, and 90nm is even more problematic. The days of independent design and manufacturing are over. Design will increasingly impact the yield and cost of manufacturing; and manufacturing's error rate, yield rate, mask costs, and process technologies will increasingly impact design methodology. It's up to design and manufacturing to work hand in hand to make design for manufacturing as painless as possible for all involved. Dr. de Geus will review where the industry stands in regard to these issues, and how the electronic design automation industry and design and manufacturing companies can solve these challenges. Wednesday, July 14, 1:00-2:00 p.m. Parkside Hall, San Jose Bruce Freyman, President and Chief Operating Officer, Amkor Technology, will present “Semiconductor Assembly and Test: A New Paradigm.” Advances in microelectronics technology are enabling increasingly sophisticated electronics, and consumers are demanding more functionality in smaller spaces. As the industry moves towards more integration of form and function, the nature of IC packaging is changing. This new paradigm is creating critical challenges for the traditional IC assembly model and is resulting in acceleration in the outsourcing of assembly and test. Wednesday, July 14, 2:00-3:00 p.m. Parkside Hall, San Jose Executive Panel Discussion: "Outsourcing Assembly and Test in the Face of Changing Technology" Semiconductor assembly and test operations have been changing rapidly. The outsourcing of assembly operations has been heavily adopted, but continues to expand. Test has been slower to outsource, but has accelerated rapidly through the last several years. The panel discussion moderated by Ron Leckie, president, INFRASTRUCTURE Advisors, will immediately follow the Wednesday keynote presentation by Bruce Freyman. Panelists Eelco Bergman, senior vice president of Business Development at Amkor; Dr. David Pan, president of ASE Test Ltd; Gene Gretchen, group vice president and managing director, ST Malta and other invited panelists will explore the potential for continued outsourcing penetration; the technology and business challenges that make outsourcing decisions difficult; and the impact that new wafer-level packaging technologies will have on the outsource model. Thursday, July 15, 2:00-3:00 p.m. Parkside Hall, San Jose Executive Panel Discussion: "Manufacturing Test’s Role in Linking Nanometer-scale Design and Manfacturing" Recent data suggests that by 90nm, the ramp to nominal yield will exceed the lifetime of the average IC. Failure analysis based on advanced diagnostics should be able to significantly accelerate yield ramp and increase the production yield. However, this will require a new design-based analysis infrastructure integrated into the manufacturing environment. A panel of industry technologists will highlight the role that failure-based diagnostics based on manufacturing test can play in linking together nanometer-scale design and manufacturing and discuss yield ramp bottlenecks at 90nm and 65nm; design/process interaction issues; manufacturing test capabilities and design-for-test; and issues related to integration of diagnostics-based failure and high-volume diagnostics-based statistical information. Friday, July 16, 12:00-1:30 p.m. Parkside Hall, San Jose Executive Panel Discussion: "Wafer Bumping Technology Strategies & Status" Wafer bumping technologies continue to gain traction with the promise of further automating packaging processes. They are borrowing automation from the semiconductor front-end and are opening further dialog across the spectrum of semiconductor operations. The panel discussion moderated by Greg Reed, Reed Media Services, will explore stepper lithography and screen deposition bump formation technologies, reflow processing of bumped wafers, X-ray inspection techniques to ensure high yield production, and an examination of bump material composition. Panelists Joachim Kloeser, chief technology officer, EKRA; Elvino da Silveira, president, Azores Technology; Kristen Mattson, Semiconductor Products Manager, BTU International; Dr. Udo E. Frank, FEINFOCUS GmbH and Fritz Byle, chief technology officer, Semiconductor Materials, Kester Solder, will present the merits of various technologies and potential pitfalls to implementation. |
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NORTH AMERICAN SEMICONDUCTOR EQUIPMENT INDUSTRY POSTS MAY 2004 BOOK-TO-BILL RATIO OF 1.11 |
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| SAN JOSE, Calif., June 17, 2004 -- North American-based manufacturers of
semiconductor equipment posted $1.58 billion in orders in May 2004 (three-month
average basis) and a book-to-bill ratio of 1.11 according to the May 2004
Book-to-Bill Report published today by SEMI. A book-to-bill of 1.11 means
that $111 worth of orders were received for every $100 of product billed
for the month. The three-month average of worldwide bookings in May 2004 was $1.58 billion. The bookings figure is nominally even with the revised April 2004 level of $1.58 billion and 118 percent above the $724 million in orders posted in May 2003. The three-month average of worldwide billings in May 2004 was $1.42 billion. The billings figure is two percent above the revised April 2004 level of $1.39 billion and 77 percent above the May 2003 billings level of $805 million. "Billings for semiconductor manufacturing equipment have increased sequentially in each of the past eleven months and are at the highest levels since May of 2001," said Stanley T. Myers, president and CEO of SEMI. "Sales in the first five months of 2004 are more than 50 percent higher than those in the first five months of 2003. The apparent stabilization of bookings and billings at these high levels indicates that 2004 will be a strong year for the semiconductor capital equipment market." The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars. |
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| The data contained in this release was compiled by David Powell, Inc.,
an independent financial services firm, without audit, from data submitted
directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data. The data are contained in a monthly Book-to-Bill Report (previously entitled the Express Report) published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The June 2004 SEMI Book-to-Bill Report is scheduled for publication on July 19, 2004; 3:00 PDT (subject to change). SEMI is a global industry association serving companies that develop and provide manufacturing technology and materials to the global semiconductor, flat panel display, MEMS and related microelectronics industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org. ASSOCIATION CONTACTS: Dan Tracy/SEMI Tel: 1.408.943.7987 E-mail: dtracy@semi.org Jonathan Davis/SEMI Tel: 1.408.943.6937 E-mail: jdavis@semi.org |
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SEMI REPORTS FIRST QUARTER 2004 WORLDWIDE SEMICONDUCTOR EQUIPMENT FIGURES; BILLINGS INCREASE TO US$9.14 BILLION |
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| SAN JOSE, Calif., June 15, 2004 ‐ SEMI today reported that worldwide semiconductor
manufacturing equipment billings reached US$9.14 billion in the first quarter
of 2004. The figure is 65 percent above the same quarter a year ago and
42 percent above the billings figure for the fourth quarter of 2003.
The data is gathered in cooperation with the Semiconductor Equipment Association
of Japan (SEAJ) from more than 150 global equipment companies that provide
data on a monthly basis. SEMI also reported worldwide semiconductor equipment bookings of US$9.60 billion in the first quarter of 2004. The figure is 118.0 percent above the same quarter a year ago and 9.3 percent above the bookings figure for the fourth quarter of 2003. "The strength of the first quarter billings and bookings supports the outlook for a robust growth year for the semiconductor equipment market," said Stanley T. Myers, president and CEO of SEMI. "Billings levels in all regions were strong sequentially, and based on bookings will remain so in the second quarter." The quarterly billings data by region in billions of U.S. dollars, year-over-year and quarter-over-quarter growth rates by region are as follows: |
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| Source: SEMI/SEAJ June 2004 Note: Figures may not add due to rounding. Billings levels for new semiconductor equipment in China for the first quarter of 2004 were $570 million. SEMI began publishing monthly bookings and billings data for China in 22 equipment segments starting in January 2004. "SEMI is the only source of discreet semiconductor equipment market data for the China region and we are now pleased to offer this important information to our industry," said Myers. "To provide the China market breakout, we have worked throughout 2003 in collaboration with the SEAJ and more than 150 participant companies that report actual billings and order information for new equipment." The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Book-to-Bill Report, which offers an early perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (WW SEMS), a detailed report of semiconductor equipment bookings and billings for seven regions and 22 market segments; and the SEMI Semiconductor Equipment Consensus Forecast, which provides an outlook for the semiconductor equipment market. For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers). SEMI is a global industry association for companies participating in the microelectronics and display industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit SEMI at www.semi.org. MEDIA CONTACT: Dan Tracy/SEMI Ph: 408.943.7987 E-mail: dtracy@semi.org Jonathan Davis/SEMI Ph: 408.943.6937 E-mail: jdavis@semi.org |
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JAPAN LEADS IN VALUE CHAIN FOR FPD MANUFACTURING: TAIWAN CATHING UP China Emerges as New Region for TFT LCD |
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| Taipei, Taiwan, June 10, 2004 - The value chain for the TFT LCD manufacturing
industry is strongest in Japan, with Taiwan companies quickly catching
up, according to speakers at the FPD Taiwan 2004 Business and Technology
Forum. Japanese companies provided the most comprehensive range of TFT LCD materials, including glass substrates, color filters, backlights, polarizers, and driver ICs. "Taiwan is starting to catch up [in the value chain] but for high end production still relies on Japanese suppliers,” according to Jacob Lin, chairman of the FPD Industrial Forum in Taiwan. Korean companies, most notably Samsung Electronics, adopted the vertical integration model and have in-house production of components such as glass substrates and color filters. In 2004 global FPD revenues are expected to reach $45 billion, with Taiwan companies accounting for about $14 billion, said Lin, citing data from market research firm DisplaySearch. “Taiwan revenue is about one third of the world revenue,” he said. However, “Korea has a larger market share than Taiwan.” Given the strong competition from Korean FPD makers, Lin suggested that Taiwan companies should partner with Japan to strengthen their competitive edge. In general, Lin suggested that co-operation and partnerships between all FPD panel makers would be better for long term industry growth than head to head competition. An emerging region for FPD panel manufacturing is China. Toshio Ohta, vice president of Shanghai SVA NEC LCD Co. Ltd., gave an overview of the China market. He said the strategy of his company, which is expected to enter into production of Generation 5 panels in October this year, will be to serve the LCD monitor and notebook PC display business. “We are beginners, not as strong as Taiwan and Korea,” Ohta said. For that reason, the SVA NEC joint venture would not be targeting the emerging flat panel TV market where much larger glass substrates are required. Ohta noted that the local materials supply chain for TFT LCD manufacturing was practically non-existent in China now. “It is very difficult to get material in China for TFT LCD production,” he said. The SVA NEC fab will be importing all of its materials, mostly from Japanese suppliers. Worldwide shipments of large size TFT LCDs for TVs are expected to skyrocket from 5.6 million units last year to 25 million in 2006, according to DisplaySearch. Over the same period TFT panels for LCD monitors would rise from 51.5 million units to 122 million, and notebook PCs from 34 million to 49 million. The demand for LCD glass substrates is expected to grow at a compound annual rate of 50 percent from 2003 to 2006, driven mostly by TV and LCD monitor applications, according to Nitin Kulkarni, president of Corning Display Technologies Taiwan. Another speaker, Ruurd Boomsma, executive vice president of Unaxis, said there was no technical limitation to manufacturing with bigger glass substrates. However, he noted that the “cost down” effect of using larger manufacturing equipment was getting smaller. For that reason, to achieve significant cost reductions in large size panels for TVs, other parts of the FPD supply chain would need to play a bigger role. The FPD Taiwan 2004 expo, featuring more than 200 exhibiting companies occupying 560 booths, continues to June 12 at the Taipei World Trade Center. SEMI is a global industry association for companies participating in the microelectronics and display industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit SEMI at www.semi.org. ASSOCIATION CONTACTS: Jonathan Davis/SEMI Ph: 408.943.6937 E-mail: jdavis@semi.org |
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SEMI EXPO CIS 2004 FOCUSES ON MICROELECTRONICS OPPORTUNITIES IN RUSSIA AND THE COMMONWEALTH OF INDEPENDENT STATES |
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| Moscow, Russian Federation, 9 June 2004 -- Extensive technological capabilities,
a community of skilled engineers and a tradition of scientific excellence
that dates back to the Soviet era have made Russia and the Commonwealth
of Independent States (CIS) attractive to the world's leading high-tech
businesses. Global semiconductor enterprises that have recently exploited
these resources, along with companies that see them as an opportunity for
further investigation, will meet with their counterparts in the region
at the SEMI Expo CIS 2004. The four-day conference and exhibition will
be hosted by SEMI in Moscow from 27 September through 2 October. "The SEMI Expo CIS offers an extensive array of intelligence to provide our members with a thorough and accurate view of the CIS market place, taking into account the growing rate in productivity," said Alla Famitskaya, regional director of SEMI CIS. In addition to the product exhibition which occurs on September 28-29, the SEMI Expo CIS 2004 will feature two executive business conferences, an executive roundtable, a technology symposium, industry standards workshops, a product exhibit and an optional tour to microelectronics facilities in the vicinity of St. Petersburg. The Industry Strategy Symposium (ISS), which will be held for the first time in Russia on 27 September, includes leading analysts, industry executives and academicians who will examine the latest market trends in the development of micro- and nano-electronics technologies in the CIS. The symposium is organized to address four major themes: innovation, investments, productivity and applications. "How To Do Business in Russia" will be the subject of the Market Conference to be held on September 30 in cooperation with market research firm Future Horizons. The latest global and CIS market analysis will be presented by both international and local experts. Also on September 28, industry leaders from the region's semiconductor industry will discuss challenges and strategies to strengthen competitiveness worldwide at the CIS Executive Round Table. The ISS, Market Conference and CIS Executive Roundtable will all be held at the Moscow Metropol Hotel. The SEMI Technology Symposium, 28-29 September, will focus on semiconductor process technologies, MEMS/MST, AEC/APC, Power Electronics, FPD. The optional tour to St-Petersburg on 1-2 October will include a visit to the Microelectronics Center of the Physics & Technology Institute named after the Academician A. Ioffe. For registration and further information, please visit the SEMI website at www.semi.org or contact SEMI offices in Moscow at 7.095.931.96.47 or in Brussels at 32.2.289.64.98. For Press Credentials to attend the event, please contact Vincent Dubois in Brussels (+32.2.289.64.95; vdubois@semi.org) or Jonathan Davis in San Jose, Calif. (+1.408.943.6937; jdavis@semi.org). SEMI is a global industry association for companies participating in the microelectronics and display industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Singapore, Tokyo, Shanghai and Washington, D.C. For more information, visit SEMI at www.semi.org. ASSOCIATION CONTACTS: Alla Famitskaya/SEMI CIS Tel: 7.095.931.96.47 E-mail: afamitskaya@semi.org Vincent Dubois/SEMI Europe Tel: 32.2.289.64.95 E-mail: vdubois@semi.org Jonathan Davis/SEMI Tel: 1.408.943.6937 E-mail: jdavis@semi.org |
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CREATORS AND INNOVATORS GATHER FOR OPENING OF FPD EXPO TAIWAN Taiwan's Investment in TFT LCD Manufacturing Exceeds NT$100B |
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| Taipei, Taiwan, June 9, 2004 - The creators and innovators of the flat
panel display (FPD) industry converged on Taiwan today for the opening
of FPD Taiwan 2004, scheduled to run until June 12 at the Taipei World
Trade Center. Wind and rain from a nearby typhoon didn't dampen the spirits of participants on the opening day of the event, organized by SEMI in conjunction with PIDA, the Taiwan Photonics Industry & Technology Development Association. The FPD Taiwan 2004 expo features more than 200 exhibiting companies occupying 560 booths, making it one of the largest dedicated FPD expositions in the world. "The TFT LCD industry is booming in Taiwan. Investment [here] has accumulated to more than NT$100 billion [approx. US$ 30 million]," said Yen-Shiang Shih, a vice minister in Taiwan's Ministry of Economic Affairs (MoEA), speaking at the opening ceremony of the expo. "We expect the industrial output of Taiwan's TFT LCD industry will reach more than NT$1 trillion before the year 2008." Shih added that Taiwan’s universities and research organizations were carrying out research and educational programs to provide technology and manpower support for the FPD sector. Stan Myers, president and CEO of SEMI, told the opening ceremony audience that the expo was a meeting place for "creators and innovators of this industry, and [they] will move it forward." "FPD is more than just a technology. I believe it is a human experience and that will continue the innovation and drive of this industry," Myers said. He added that the FPD sector was destined to become one of the cornerstones of the high tech world. Speakers at the Business and Technology Forum, held in conjunction with the expo, highlighted trends and developments in the FPD sector. Paul Semenza, executive vice president with iSuppli/Stanford Resources, noted that capital investment for TFT LCD fabs has grown from about $500 million for Generation 4 substrates, to almost $2.5 billion for the Generation 7 technology. Gen 7 fabs use glass substrates measuring 1.8 x 2.2 meters. In 2003, TFT LCDs exceeded 50 percent of the total value of the display market and are expected to continue to take market share from other technologies, according to Semenza. During a SEMI International Standards session on the first day of the expo, it was noted that in the past most technical standards adopted by FPD makers were based on experience in the semiconductor industry. However, as the size of glass substrates grows - dwarfing the 300mm diameter wafers used by chipmakers - the need for dedicated FPD standards is increasingly important. "We need to establish our own standards for the FPD industry", said Ken-ichiro Okuda, senior coordinator in the standards department of SEMI Japan. SEMI is a global industry association for companies participating in the microelectronics and display industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit SEMI at www.semi.org. ASSOCIATION CONTACTS: Jonathan Davis/SEMI Ph: 408.943.6937 E-mail: jdavis@semi.org |
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FPD Taiwan 2004 Features More Than 200 Exhibiting Companies; Opens June 9 Taiwan’s FPD Revenues May Rival Semiconductor Output by 2006 |
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| Taipei, June 6, 2004 - An investment boom in Taiwan’s flat panel display
(FPD) manufacturing industry is generating strong interest in FPD Taiwan
2004, scheduled to run June 9-12 at the Taipei World Trade Center. The
expo, organized by SEMI and PIDA, will feature 208 exhibiting companies
occupying 560 booths ? twice the size of the 2003 event. Details on the expo, and trends in Taiwan’s FPD industry, were presented during a pre-show press conference held today. Of the more than 200 participating companies at the expo, just over 150 are from Taiwan. There are 19 exhibiting companies from Korea and 13 from Japan, with the remainder from the U.S. and Europe. Driving interest in the sector is the spectacular growth of FPD revenues in Taiwan, which are expected to grow by 28 percent year-over-year to about US$20 billion in 2004, according to PIDA. "The target output within two years is $30 billion,” said George Lin, president of SEMI Southeast Asia. If that’s the case, FPDs will exceed semiconductor output in Taiwan" Figures provided by PIDA show that in Q1 2004 Taiwan’s global share of the large size panel production was 38 percent, vs. 44 percent for Korea and almost 18 percent for Japan. In comparison, in Q1 2002 the three regions were roughly equal at 33 percent market share each for large sized panel output. Murphy Lin, project manager for PIDA, noted that the FPD sector in Taiwan was attracting investment from all over the world, creating a strong infrastructure for the production of FPDs. Although most of the investment to date has been for the production of TFT LCDs, competing technologies such as organic LEDs (OLED) and plasma display panels (PDP) were receiving increased investments. Running concurrently with FPD Taiwan 2004 is the Business and Technology Forum, featuring speakers from companies such as Chi Mei Optoelectronics, RitDisplay, NEC, Seiko Epson, Unaxis, Ulvac, AKT, Kodak and Corning. FPD standards are included in the program, with sessions covering the global standards development roadmap for FPDs, and environmental, health and safety issues in the FPD industry. FPD Taiwan 2004 is organized by SEMI and PIDA, the Photonics Industry and Technology Development Association. The next FPD Taiwan is scheduled for June 8-11, 2005. The FPD expo is co-located with Opto Taiwan, organized by PIDA. SEMI is a global industry association serving companies that develop and provide manufacturing technology and materials to the global semiconductor, flat panel display, MEMS and related microelectronics industries. It maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org. ASSOCIATION CONTACTS: Cher Wu/SEMI Taiwan Tel: +866.3.573.3399 E-mail: cwu@semi.org Jonathan Davis/SEMI Tel: +1.408.943.6937 E-mail: jdavis@semi.org |
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SEMI Publishes 12 New Standards Related to Semiconductor, FPD Manufacturing More than 680 Standards Published Since Program Established |
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| San Jose, Calif., June 3, 2004 -- SEMI has published 12 new technical standards
applicable to the semiconductor and flat panel display manufacturing industries. The new standards, developed by technical experts from equipment suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI website, www.semi.org. SEMI Standards are published three times a year. The new standards, part of the July 2004 publication cycle, join more than 680 standards that have been published by SEMI during the past 31 years. Included in the new standards are specifications for markers on FPD polarizing films, specifications for information tagging on IC manufacturing equipment, guidelines for specifying silicon annealed wafers, and specifications for SECS and XML protocols for tracking jigs and implements “The new SEMI standards encompass a broad range of technical areas, highlighting the diverse nature of the SEMI International Standards program.” said Bettina Weiss, SEMI’s director for International Standards and MEMS. “We are particularly pleased with the continued support of the semiconductor community in contributing to the standards development process.” The standards released today include: SEMI D39 Specification for Markers on FPD Polarizing Films SEMI D40 Terminology for FPD Substrate Deflection SEMI E36.1 Specification for Semiconductor Equipment Manufacturing Information Tagging SEMI E120.1 XML Schema for the Common Equipment Model (CEM) SEMI E134 Specification for Data Collection Management SEMI E135 Test Method for RF Generators to Determine EA Software Transient Response for RF Power Delivery Systems Used in Semiconductor Processing Equipment SEMI F96 Specification for Port Configuration of Canisters to Contain Liquid CVD Precursors SEMI M57 Guide for Specifying Silicon Annealed Wafers SEMI M58 Test Method for Evaluating DMA-Based Particle Deposition Systems and Processes SEMI T12.1 Specification for SECS Protocol for Tracking Jigs and Implements SEMI T12.2 Specification for XML Protocol for Tracking Jigs and Implements SEMI T13 Specification for Device Tracking: Concepts, Behavior and Services About SEMI Standards: The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays and micro-electromechanical systems (MEMS). Approximately 2,300 volunteers worldwide participate in the program, which is made up of 17 global technical committees. Visit www.semi.org/standards for further details about SEMI Standards. About SEMI: SEMI is an international industry association serving companies participating in the semiconductor and FPD equipment and materials markets. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore,Tokyo and Washington, D.C. For more information, visit www.semi.org |
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SEMICON WEST 2005 TO BE REUNIFIED IN SAN FRANCISCO |
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| SAN JOSE, Calif., May 27, 2004 -- SEMICON West, the largest exposition
for semiconductor manufacturing technology in North America, will be reunited
in San Francisco in 2005. In recent years, the annual exposition
has spanned twocities (San Francisco and San Jose, Calif.) in order to
accommodate the demandfor exhibit space, meeting rooms and technical programs.
Reunification of the exposition in a single venue location became possible
when exhibit and meeting facilities were expanded at the Moscone Center
in San Francisco last year. Moscone West added 300,000 sq. ft. of exhibit space to the existing 600,000 sq. ft.in Moscone North and South Halls. With the additional facility, available space exceeds historic exposition requirements and provides room for growth. "Unifying the exposition will provide greater value for visitors and exhibitors,"said Vicki Hadfield, president of SEMI North America. "The San Jose venue provided an efficient and hospitable interim solution. However, it was never desirable to host a split event. Reuniting SEMICON West allows attendees to visit a single integrated venue and use their time more productively. It also provides exhibitors with access to a concentrated community of attendees." SEMICON West was launched by SEMI in 1970 at the San Mateo County Expo Center, where it was held through 1987. The exposition was relocated to the Moscone Center, San Francisco in 1988 and eventually outgrew the available exhibit space there. SEMI then expanded the event to occupy additional exhibit facilities in San Jose in 1997, at which time the exposition was segmented by product type. Wafer Processing (Front End) exhibits and programs occur in the San Francisco venue and Final Manufacturing (Test, Assembly and Packaging) in San Jose. SEMICON West 2005 will maintain the same high-level exhibit segmentation of Wafer Processing and Final Manufacturing. Final Manufacturing will be located in the new Moscone West facility which will also house exposition keynotes and technical programs on the third floor. "There are a significant number of companies that have interest and products in both the Wafer Processing and Final Manufacturing exposition segments. Many currently choose to exhibit in only one venue, while about 70 exhibiting companies will have booths in both the San Francisco and San Jose venues this year, said Hadfield. "Reunification benefits the numerous exhibitors and many visitors that have interests in both SEMICON West segments." SEMICON West exhibitors will have the opportunity to meet with SEMI exposition managers and select SEMICON West 2005 exhibit space during the on-site space selection, which will be held for the first time at SEMICON West 2004. Additionally, to familiarize interested exhibitors with the new facility, SEMI is organizing Moscone West facility tours on June 16 and June 24. Tours may also be conducted July 11-13 during SEMICON West 2004 based on customer requests. The 34th edition of SEMICON West occurs July 12-16, 2004. The expo opens at the Moscone Center with the Wafer Processing segments, July 12-14, and continues at the San Jose Convention Center with Final Manufacturing programs and exhibits, July 14-16. The event will feature more than 1,500 exhibitors in 3,700 booths and include an array of technical programs, keynote speakers, standards meetings and other events. SEMICON West 2005 events will span the week of July 11-15, 2005, with the product exhibition occuring from July 12-14. SEMI is a global industry association for companies participating in the microelectronics and display industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore,Tokyo and Washington, D.C. For more information, visit SEMI at www.semi.org. ASSOCIATION CONTACTS: Jonathan Davis/SEMI Ph: 408.943.6937 E-mail: jdavis@semi.org |
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SEMIテクノロジーシンポジウム（STS）2004 講演論文募集のお知らせ |
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| SEMI (Semiconductor Equipment and Materials International、本部：米国カリフォルニア州サンノゼ)
は、2004年12月1日（水）～3日（金）の3日間にわたり幕張メッセ国際会議場で開催する「SEMIテクノロジーシンポジウム(STS)
2004」で講演いただく論文を募集いたします。 SEMIテクノロジーシンポジウムは、1982年よりSEMI主催の半導体製造装置・部品材料の国際展示会「セミコン・ジャパン」に併催して開催している半導体製造技術のシンポジウムで、今年で23回目の開催となります。毎年、半導体の技術動向・技術課題を洗い出し、実用化技術を提示する場として、また、国内外の半導体メーカーと製造装置・材料メーカーの技術交流の場として、高い評価をいただいています。昨年は、9セッション83講演が行われ、のべ約1,200名が参加いたしました。 講演論文の募集要項は、下記の通りです。 ◆ 応募方法： 論文骨子を和文400文字、または英文200～250ワードにまとめ、その他必要事項(発表 者名、所属先名、連絡先など)とともに電子メールでご応募ください。詳細は、SEMIのWEB サイト（www.semi.org/）をご覧ください。 ◆論文の要件：下記セッションの何れかの分野に該当するもので、日本語または英語で発表される もの。 ◎セッション： 先端デバイス技術、リソグラフィ、多層配線、ナノテクノロジー、65～45nm世代のフロント エンドプロセス、マスク、マニュファクチャリングサイエンス、パッケージング ※各セッションの詳細はWEBサイト（www.semi.org/）でご確認ください。 ◆応募締切り： 2004年7月1日（木） ◆論文の採択：SEMIテクノロジーシンポジウム プログラム委員会において選考し、結果は9月初旬より、 順次、応募者宛てにご連絡します。 ◆問合わせ先：SEMIジャパン 南木（みなき）、岩口 E-MAIL:aminaki@semi.org、TEL:03-3222-5803、FAX:03-3222-5790 SEMIテクノロジーシンポジウム（STS） 2004 開催概要 ・会期 ： 2004年12月1日（水）～3日（金） ・会場 ： 幕張メッセ国際会議場 ・主催 ： SEMI セミコン・ジャパン 2004 開催概要 ・会期 ： 2004年12月1日（水）～3日（金） ・会場 ： 幕張メッセ 国際展示場1～11ホール ・主催 ： SEMI ･･･････････････････････････････････････････････････････････････････････････････････・・ 本件お問合せ先： ■SEMIテクノロジーシンポジウム(STS)について SEMIジャパン マーケティング部 E-Mail: jeventinfo@semi.org、Tel: 03-3222-6020、 Fax:03-3222-5757 ■メディア・コンタクト SEMIジャパン マーケティング部 E-Mail: jpress@semi.org、Tel: 03-3222-6020、 Fax:03-3222-5757 |
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SEMI、2004年第1四半期のシリコンウェーハ出荷面積を発表 これまでになく多い出荷面積を記録 |
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| SEMI (Semiconductor Equipment and Materials International、本部：米国カリフォルニア州サンノゼ) は、5月11日（米国時間）、SEMI Silicon Manufacturers Group (SMG) によるシリコンウェーハ業界の四半期毎の分析結果をもとに、2004年第1四半期（暦年）の全世界シリコンウェーハ出荷面積は前期比9％増し、2003年第1四半期と比較すると29％増となったと発表しました。 2004年第1四半期の全シリコンウェーハ出荷面積は15億1400万平方インチで、前期の13億9200万平方インチから増加しました。 SEMI SMGのチェアマンで、MEMC Electronic Materials, Inc.のマーケティング担当副社長であるJohn Kaufmann (ジョン・カウフマン)氏は、次のように述べています。「出荷が2000年の最高レベルを上回り、また工場稼働率が向上していることから、シリコン産業界は2004年の大きな成長を予想しています。200mm以下のウェーハの価格は安定しはじめてはいますが、300mmウェーハの売上はシリコンミックスのかなりの部分を占めるようになってきているにもかかわらず、収益の向上は依然として出荷面積の拡大に遅れをとっています。持続的な収益性の確保は、依然として私たちの産業における重要課題です。」 シリコンウェーハ出荷面積四半期毎動向 |
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| シリコンウェーハは半導体の基本材料であり、半導体は、コンピュータ、通信機器、家電をはじめとするあらゆるエレクトロニクス関連製品のきわめて重要な部品です。シリコンウェーハは、高度な技術で作られた薄い円盤状の素材で、様々な直径(1インチから300mmまで)で製造されており、殆どの半導体デバイス（チップ）の基板材料として使われています。 本リリースで用いている数値は、ウェーハメーカーよりエンドユーザーに出荷されたバージンテストウェーハを含む鏡面ウェーハ、エピウェーハ、ノンポリッシュウェーハを集計したものです。 SMGは、SEMIの組織の中で独立したスペシャルインタレストグループとしてその役目を果たしており、リクレームウェーハを除く多結晶シリコン、単結晶シリコンおよびシリコンウェーハ（カット、研磨、エピタキシャル加工など）の製造に携わっている全てのＳＥＭＩ会員企業に門戸を開いています。SMGの趣旨は、シリコン産業と半導体市場についての市場情報・統計データの収集を含め、シリコン産業に関する事項について集団的努力を促すことにあります。
本件お問合せ先： ■統計内容について SEMIジャパン アドボカシー＆ニュー・テクノロジーズ部 安藤 洋一郎 E-Mail: yando@semi.org、Tel: 03-3222-5854、 Fax:03-3222-5757 ■メディア・コンタクト SEMIジャパン マーケティング部 E-Mail：jpress@semi.org、Tel: 03-3222-6020、 Fax:03-3222-5757 |
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「SEMI FORUM JAPAN 2004」 6月15日（火）～17日（木）、グランキューブ大阪にて開催 |
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| SEMI（Semiconductor Equipment and Materials International）は、本年6月15日（火）～17日（木）の3日間、大阪市北区のグランキューブ大阪（大阪国際会議場）にて、第4回「SEMI FORUM JAPAN（SFJ） 2004」を開催します。 「SEMI FORUM JAPAN」は、システム、デバイス、装置、材料など半導体バリューシステムを包括するセミナー主体のイベントで、2003年6月に開催された第3回SEMI FORUM JAPANには、業界関係者のべ2,411名が参加しました。 第4回の開催となる本年も「IT System & ULSI Technology」をテーマに、3日間で19のプログラムおよび9つのスタンダード関連会議が企画されています。また、応用物理学会、半導体業界ソフトウェア供給会社交流会（VANS）、半導体シニア協会（SSIS）、日本半導体ベンチャー協会（JASVA）よりも協賛・協力を受け、これら各団体主催のプログラムも開催されます。 今回のSEMI FORUM JAPANでは、今後のビジネス拡大が期待されるテジタル家電、自動車分野に焦点をあて、日本の半導体事業戦略のあるべき姿を考えます。 初日6月15日の「SEMI/JASVA基調講演会」には、液晶TV等のデジタル家電分野をリードするシャープ株式会社の代表取締役副社長 三坂 重雄氏をお迎えし、「シャープの事業戦略 デバイス／デジタル家電」と題し、今後ますます成長が期待される家電分野とその発展に必要不可欠となるデバイスについて、同社の“オンリーワン戦略“を中心にご講演いただきます。本基調講演会は、聴講無料でどなたでもご参加いただけます。（登録制） また、同日午後のエグゼクティブシンポジウムのパネル討論では、”新世代アプリケーションに向けた半導体ビジネス“をテーマに議論していただきます。パネラーは、エグゼクティブシンポジウムでご講演いただく、ゴールドマン・サックス証券 松橋 郁夫氏、日本アイ・ビー・エム 岩野 和生氏、ルネサスソリューションズ 林 義弘氏、松下電器産業 河嶋 和美氏、三洋電機 春木 俊宣氏の五氏です（講演順）。 技術セミナーでは、業界の第一線で活躍されている講師陣からご講演いただきます。本年は、「マニュファクチャリングサイエンスセミナー ―自動車とデジタルカメラ搭載LSI技術―」、「フロントエンドプロセスセミナー ―フロントエンドプロセスの先端技術展望―」、「プロセス・デバイス技術セミナー ―ディープサブミクロン時代のローパワー技術―」、「微細化のブレイクスルーセミナー ―ArF液浸リソの完成度とポスト液浸技術―」、「多層配線技術セミナー ―65nmノードへの展望―」といったテーマが企画されています。 「IC Tutorialセミナー」では、多層配線、リソグラフィ、エッチング、拡散・注入の4つのコースで、半導体デバイス製造プロセスの基礎から最先端技術まで解説いたします。 その他、「第6回SEMIマイクロマシンセミナー ―Power MEMS―」、「SEMIマーケットセミナー」、各種SEMIスタンダード会議なども予定されています。 「SEMI FORUM JAPAN 2004」の詳細は、Webサイトでご案内しています。 ・URL：http://www.semireg.org/ また、参加お申し込みは、本日5月6日（木）より、上記WEBサイトで受け付けを開始いたします。 なお、本フォーラムの内容、お申し込みなどのお問い合わせは、下記でお受けしています。 ・SEMIジャパン マーケティング部 E-Mail： jeventinfo@semi.org、 Tel: 03-3222-5993、 Fax:03-3222-5790 「SEMI FORUM JAPAN 2004」 開催概要 ● 会期： 2004年6月15日(火)～17日(木) ● 会場： グランキューブ大阪（大阪国際会議場） 大阪市北区中之島 ● 主催： SEMI ● 協賛： 日本半導体ベンチャー協会(JASVA)、SSIS半導体シニア協会 ● 聴講： 有料 ※SEMI/JASVA基調講演会は無料 ● WEBサイト： http://www.semireg.org/ ● プログラム概要： 6月15日（火） SEMI/JASVA基調講演会 「シャープの事業戦略 デバイス／デジタル家電」 シャープ株式会社 代表取締役副社長 三坂 重雄 SEMI FORUM JAPANエグゼクティブシンポジウム 「日本の半導体は大丈夫か」 ゴールドマン・サックス証券 松橋 郁夫 「IBMの考えるITの技術動向と最近の話題」 日本アイ・ビー・エム 岩野 和生 「ルネサスの自動車用半導体戦略と展開」 ルネサスソリューションズ 林 義弘 「ディジタル家電(TV)用システムLSI」 松下電器産業 河嶋 和美 「デジタルスチルカメラ開発と半導体への期待」 三洋電機 春木 俊宣 パネル討論 － 新世代アプリケーションに向けた半導体ビジネス － JASVA Day OSAKA （主催：日本半導体ベンチャー協会） － 日本各地から烽火が上がり始めたベンチャースピリット － 応用物理学会シリコンテクノロジー分科会 研究集会 （主催：応用物理学会シリコンテクノロジー分科会） － 接合技術ワークショップ － SEMIスタンダード会議 SEMI FORUM JAPANフレンドシップパーティ 6月16日（水） SSIS半導体シニア協会特別シンポジウム （主催：SSIS半導体シニア協会） マニュファクチャリングサイエンスセミナー － 自動車とデジタルカメラ搭載LSI技術 － 第6回マイクロマシンセミナー － Power MEMS － フロントエンドプロセスセミナー － フロントエンドプロセスの先端技術展望 － 応用物理学会関西支部主催セミナー （主催：応用物理学会関西支部） － 高・強誘電体材料の薄膜プロセスとデバイス － IC Tutorialセミナー：多層配線コース、リソグラフィコース SEMIスタンダード会議 6月17日（木） 多層配線技術セミナー － 65nmノードへの展望 － 微細化のブレイクスルーセミナー － ArF液浸リソの完成度とポスト液浸技術 － プロセス・デバイス技術セミナー － ディープサブミクロン時代のローパワー技術 － SEMIマーケットセミナー VANSセミナー （主催：半導体業界ソフトウェア供給会社技術交流会） － ここまできたAPC/FDC半導体製造ラインを変革するアプリケーションおよびツール － SEMIスタンダード会議 ･･･････････････････････････････････････････････････････････････････････････････････ 本リリースへのお問合せ ■「SEMI FORUM JAPAN 2004」について SEMIジャパン マーケティング部 E-Mail:jeventinfo@semi.org Tel: 03-3222-5993、 Fax:03-3222-5790 ■メディア・コンタクト SEMIジャパン マーケティング部 E-Mail：jpress@semi.org Tel: 03-3222-6020、 Fax:03-3222-5757 |
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NORTH AMERICAN SEMICONDUCTOR EQUIPMENT INDUSTRY POSTS MARCH 2004 BOOK-TO-BILL RATIO OF 1.10 |
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| SAN JOSE, Calif., April 19, 2004 -- North American-based manufacturers
of semiconductor equipment posted $1.32 billion in orders in March
2004 (three-month average basis) and a book-to-bill ratio of 1.10,
according to the March 2004 Express Report published today by SEMI.
A book-to-bill of 1.10 means that $110 worth of new orders were received for
every $100 of product billed for the month. The three-month average of worldwide bookings in March 2004 was $1.32 billion. The bookings figure is even with the revised February 2004 level of $1.32 billion and 70 percent above the $777 million in orders posted in March 2003. The three-month average of worldwide billings in March 2004 was $1.20 billion. The billings figure is five percent above the revised February 2004 level of $1.14 billion and 40 percent above the March 2003 billings level of $857 million. "Stable bookings levels are indicative of healthy growth as companies invest in capacity expansion that is rational," said Lubab Sheet, research development director of SEMI. "Looking forward, guidance from companies points to continued strength in bookings and billings." The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars. |
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| The data contained in this release was compiled by David Powell, Inc.,
an independent financial services firm, without audit, from data submitted
directly by the participants. SEMI and David Powell, Inc. can assume no
responsibility for the accuracy of the underlying data. The data are contained in a monthly Express Report published by SEMI that tracks billings and bookings worldwide of North American-based manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The April 2004 Express Report is scheduled for publication on May 20, 2004 (subject to change). SEMI is a global industry association serving companies that develop and provide manufacturing technology and materials to the global semiconductor, flat panel display, MEMS and related microelectronics industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org. INDUSTRY/IR CONTACT: Lubab Sheet./SEMI Tel: 1.408.943.6921 E-mail: lsheet@semi.org MEDIA CONTACT: Michael Droeger/SEMI Tel: 1.408.943.6953 E-mail: mdroeger@semi.org |
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「SEMI FPD Expo Japan 2004」 間もなく開催 ４月７日（水）～９日（金）、東京ビッグサイト 東展示棟にて |
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| SEMI（Semiconductor Equipment and Materials International）は、フラットパネルディスプレイ（FPD）製造装置・部品材料の国際展示会「SEMI
FPD Expo Japan 2004」（SFE Japan 2004）を、来る4月7日（水）～9日（金）の3日間、東京ビッグサイト東展示棟にて開催いたします。本年も、社団法人電子情報技術産業協会（JEITA）が主催する「EDEX2004
電子ディスプレイ展」と同会場で同時開催いたします。 大手製造装置メーカーの最新ラインナップはもとより、TFT-LCDの次世代向大型製造装置、有機EL、PDP等の最新製品・材料・技術などが、世界7カ国／地域、137社／団体（昨年11カ国／地域、165社／団体）の出展社によって展示されます。 SEMIジャパン代表の内田傳之助は、本展示会開催にあたり「昨年後半よりの世界経済の回復に伴い、日本のエレクトロニクス産業も往年の活況を取り戻しつつあり、デジタル家電分野を中心に改めて世界の注目を集めています。 昨年12月には地上デジタル放送が開始されPC用途に加えて液晶TV市場の更なる拡大が期待されるなど、高度情報化社会のインターフェースとしてFPDはその重要性をますます高めています。」、「各出展社の最先端のFPD製造装置・部品材料が顔を揃えるSEMI FPD Expo Japanは、併催のEDEX2004 電子ディスプレイ展に出展される最新の各種パネルとあわせ幅広くFPD産業の最新情報をご提供し、ご来場の皆様の様々なご期待にお応えできるものと確信いたしております。」と述べています。 SFE Japan 2004の展示会場内は、プロセス／パネル関連ゾーン、モジュール／検査／設備関連ゾーン、有機EL／PDP関連ゾーンの3つのゾーンで構成されその他に、特設コーナーとして「アカデミアコーナー」が予定されています。アカデミアコーナーは大学による展示コーナーで、各大学が取り組む最先端技術が展示され、次世代技術の萌芽をご覧いただくことができます。 例年、産学交流の場としてもご活用頂いています。 本年は下記8大学が参加いたします。 -成蹊大学 工学部 電気電子工学科 電子デバイス研究室 -千歳科学技術大学 光科学部 物質光科学科 安達研究室 -千葉大学 工学部 電子機械工学科 分子機能デバイス研究室 -東海大学 電子情報学部 エレクトロニクス学科 エレクトロニクス第17研究室 -東京農工大学 工学部 機械システム工学科 大谷研究室 -長岡技術科学大学 電気系 河合研究室 -名古屋大学 工学部 工学研究科 電気工学専攻 -横浜国立大学 工学部 物質工学科 井上・本田研究室 SFE Japan 2004の会期中、様々な併催イベントが開催されます。 出展社から各社の新技術／新製品をご紹介する「出展社セッション」は、各社展示ブースの見学とあわせて気軽にご参加いただけるように、展示会場内に会場を設けて行います。今年は14社が参加いたします。 出展社セッションの聴講は無料で、当日先着順に入場いただけます。 セッションのスケジュールおよび内容は、SFE Japan 2004 Webサイトでご案内しています。 SEMIの最も重要な活動の一つであるスタンダード活動（世界標準規格を策定する活動）に関しては、会期中に下記5つの会議が予定されています。 SEMIスタンダード会議は全て公開されておりますので、幅広い分野の多くの方々のご参加をお待ちしております。 4月8日（木） FPDマスク委員会 FPD基板・搬送・装置委員会 4月9日（金） バックライト・タスクフォース 偏光板タスクフォース FPDカラーフィルタ・オプティカル委員会 また、4月7日（水）10:00～17:00には、SEMIスタンダード・ワークショップとして「超大型基板を使ったFPD製造のスタンダード課題 －ユーザーの期待へのサプライヤの対応と標準化－」を開催します。 本ワークショップでは、サプライヤとユーザーの双方の観点から超大型基板でのFPD製造の課題について問題提起を行い、続いて「安全」、「（基板の）たわみ」、「振動」、「静電気対策」についての技術発表を行い課題をより明らかにすることを試みます。 FPD製造開発、検査、設計、材料等に携わるユーザーおよびサプライヤの方々のご参加をお待ちしています。 さらに、JEITAとSEMIが共催する「EDF 電子ディスプレイ・フォーラム 2004」(EDF 2004)が、4月7日（水）～9日（金）の3日間に渡って東京ビッグサイト会議棟において開催されます。 電子ディスプレイ関連の技術およびビジネスの国際的な交流の場として、毎年多くの方にご参加いただいており、本年は約2,000名の参加が見込まれています。 本年のEDFは、“デジタル放送と高速双方向伝送時代のドライビングフォース、電子ディスプレイ”をテーマに、基調講演会、特別セッションおよび9つのセッションによって構成されます。 また、「電子ディスプレイTutorial」は6セッションございます。 EDF基調講演会では、上記テーマに沿って、日本電気株式会社 佐々木 元 氏、日本放送協会 和崎 信哉 氏、松下電器産業株式会社 中島 不二雄 氏の三名にご講演いただきます。 例年、世界各地からFPD業界のエグゼクティブが集う「JEITA/SEMI 電子ディスプレイ・レセプション」は、4月7日（水）1７時30分より東京ビッグサイト会議棟のレセプションホールにて行われます。 本レセプションには約300名の参加が予定されています。 さて、本展示会は、セミコン関西より独立したFPD専門展示会として1997年にインテックス大阪において第一回を開催し、2001年よりは会場を東京ビッグサイトに移し、JEITA主催のEDEX展と同時開催の形で開催して参りました。 この間、電子ディスプレイ産業は急速な発展成長を遂げ、電子ディスプレイ、中でもフラットパネルディスプレイはデジタル社会にとり不可欠な存在となりました。 こうした環境の変化を受け、SEMIとして会員企業を始めとするFPD産業界に本展を通じたより効果的なバリュー提供の在り方につき種々検討を重ねて参りました結果、今般SFE Japanを日経BP社主催の「FPD International」と統合する事で日経BP社と合意に達し、来年2005年より、新たなる形で業界の皆様にFPDの最先端技術、最新市場情報等の入手・交換そして発信の場を提供していく事に決定いたしました。 JEITA主催のEDEX展は、来年より同じくJEITA主催の情報通信関連分野およびエレクトロニクス関連分野の複合展示会「CEATEC JAPAN」に統合されます。 以上により、SFE Japanに併せてJEITAとの共催で開催して参りました「EDF 電子ディスプレイ・フォーラム」も今回をもって終了し、来年より日経BP社との協力の下、一段と充実した形での総合フォーラムの展開を目指して参ります。 『SEMI FPD Expo Japan 2004』開催要項 名称 ：SEMI FPD Expo Japan 2004 会期 ：2004年4月7日（水）～9日（金） 3日間 開場時間 ：午前10時～午後5時 会場 ：東京ビッグサイト 東展示棟5ホール 入場 ：無料（登録制） 主催 ：SEMI （Semiconductor Equipment and Materials International） 後援 ：東京都 米国大使館 協賛 ：社団法人 映像情報メディア学会 社団法人 電子情報通信学会 日本液晶学会 社団法人 日本化学会 日本真空工業会 社団法人 有機合成化学協会 （順不同） WEBサイト：http://www.semi.org/fpdexpojapan 併催ｲﾍﾞﾝﾄ：EDF 電子ディスプレイ・フォーラム2004 （http://www.semireg.org/edf2004） (主催：社団法人電子情報技術産業協会、SEMI) JEITA/SEMI電子ディスプレイ・レセプション (主催：社団法人電子情報技術産業協会、SEMI) 出展社セッション （主催：SEMI） SEMIスタンダード会議 （主催：SEMI） スタンダード・ワークショップ （主催：SEMI） 同時開催 ：EDEX2004 電子ディスプレイ展 （http://edex.jesa.or.jp/） (主催：社団法人電子情報技術産業協会) ※本展ご取材の際は、展示会場入り口脇のプレスルームでプレス証を発行いたしますので、お立ち寄り下さいますようお願いいたします。 ･････････････････････････････････････････････････････････････････････････････････････…･… 本リリースへのお問合せ ■メディア・コンタクト SEMIジャパン マーケティング部 E-Mail：jpress@semi.org Tel: 03-3222-6020、 Fax:03-3222-5757 ■「SEMI FPD Expo Japan 2004」について SEMIジャパン 展示会部 E-Mail：sfe@semi.org Tel: 03-3222-6022、 Fax:03-3222-5757 |
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FPD Industry, IC Design Growth Highlighted at SEMICON China 2004 |
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| SHANGHAI, China, March 18, 2004 -- China's rise to prominence in the semiconductor
industry over the past four years will likely be repeated in theflat panel
display (FPD) industry, according to Derek Lidow, CEO of iSuppli/Stanford
Resources. "The display industry in China is poised to become a significant if not leading factor in the global display industry," he said. Lidow was speaking at the international FPD conference organized by iSuppli and co-sponsored by SEMI and Messe Munchen International. The event was part of the programs held on the second day of SEMICON China 2004. In a separate presentation on display market trends, iSuppli executive vice president Paul Semenza noted that in the history of the TFT LCD industry new applications have been the catalyst for investment. "At present we are seeing a new wave of investment driven by the TV industry," he said. However, the development of the flat panel TV market would be different to the previous investment waves driven by computer display applications. While TFT LCD technology was the obvious choice for notebook PCs and desktop monitors, there were many competing technologies in the flat screen TV market, including plasma and organic LED. Semenza was also bullish on China's potential for TFT LCD investment. Following in the path of Japan, Korea and Taiwan, “we believe the next wave of [TFT LCD] investments will be in China," he said. However, Semenza warned that the high capital entry cost and complexity of TFT LCD technology could prove a barrier to some Chinese companies. In terms of production of LCD monitors for computers, China already accounts for just under half of the world's output, with a 49 percent market share in Q3 2003, according to iSuppli. Taiwan was No. 2 with 18 percent, followed by Korea with 10 percent of the LCD monitor output in that quarter. The leading manufacturer of LCD monitors in China is Philips, accounting for just under 17 percent of all units produced in China in Q3 2003, according to iSuppli. Taiwan-based company BenQ was No. 2 with almost 13 percent of output. The growing interest in China's FPD manufacturing sector will be the focus on the FPD China 2004 exposition to be held in Kunshan, China, from August 11-13. The exposition will be presented by SEMI in co-operation with the China Electronic Chamber of Commerce. Another program on the second day of SEMICON China 2004 was a briefing by the International Finance Corporation (IFC) on financing strategies for the high tech industry in China. The IFC, part of the World Bank, is now targeting China's electronics manufacturing sector for equity investments. In the area of semiconductors, the IFC has already invested in Central Semiconductor Manufacturing Corp., a 6-inch foundry in Wuxi, near Shanghai. Other local sectors under consideration for investment include flat panel displays and IC assembly and test houses. Sanjay Puri, a principal investment officer for the IFC, said that over time he expected to see more semiconductor design houses and software operations moving to China. However, this was contingent on China's workforce improving both its technical expertise and English language skills. Peter Chen, chairman of foundry CSMC, supported the view that China would become a power in IC design. He provided data showing that there were now more than 450 IC design houses in China. Of those, 40 percent were located in the Shanghai/Wuxi/Hangzhou area, 26 percent were in Beijing, and 18 percent in Shenzhen in southern China. “Fabless design houses are booming," Chen said. He added: “The complete infrastructure for IC manufacturing is forming in China now." CSMC plans to more than double capacity at its 6-inch plant over the next year, to 59,200 wafers outs per month. It is also planning to build an 8-inch fab. Puri of IFC cited data from a recent study by Booz Allen Hamilton predicting that China’s share of global electronics production would almost double from 8 percent in 2001 to 14 percent by 2005, surpassing that of Western Europe. In addition, China’s compound annual growth rate in electronics production during the same five year period would be 24 percent, compared to 5 percent for Japan and 4 percent for North America. About SEMI: SEMI is a global industry association for companies participating in the microelectronics and display industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Singapore, Tokyo, Shanghai and Washington, D.C. For more information, visit SEMI at www.semi.org. |
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NORTH AMERICAN SEMICONDUCTOR EQUIPMENT INDUSTRY POSTS FEBRUARY 2004 BOOK-TO-BILL RATIO OF 1.14 |
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SAN JOSE, Calif., March 18, 2004 -- North American-based manufacturers of semiconductor equipment posted $1.31 billion in orders in February 2004 (three- month average basis) and a book-to-bill ratio of 1.14, according to the February 2004 Express Report published today by SEMI. A book-to-bill of 1.14 means that $114 worth of new orders were received for every $100 of product billed for the month. The three-month average of worldwide bookings in February 2004 was $1.31billion. The bookings figure is six percent above the revised January 2003 level of $1.23 billion and 72 percent above the $761 million in orders posted in February 2003 The three-month average of worldwide billings in February 2004 was $1.15 billion. The billings figure is 11 percent above the revised January level of $ 1.03 billion and 48 percent above the February 2003 billings level of $778 million. Bookings for new semiconductor manufacturing equipment are at their highest levels in three years and industry billings haven't been this strong since April of 2001, said Stanley Myers, president and CEO of SEMI. "The data further supports the industry outlook for strong industry growth this year." The SEMI book-to-bill is a ratio of three-month moving average bookings to three-month moving average billings for the North American semiconductor equipment industry. Billings and bookings figures are in millions of U.S.dollars.
The data contained in this release was compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. can assume no responsibility for the accuracy of the underlying data. The data are contained in a monthly Express Report published by SEMI that tracks billings and orders worldwide of North American-based manufacturers of equipment used to manufacture semiconductor devices, not billings and orders of the chips themselves. The March 2004 Express Report is scheduled for publication on April 19, 2004 (subject to change). SEMI is a global industry association serving companies that develop and provide manufacturing technology and materials to the global semiconductor, flat panel display, MEMS and related microelectronics industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org. INDUSTRY/IR CONTACT: Dan Tracy, Ph.D./SEMI E-mail: dtracy@semi.org MEDIA CONTACT: Jonathan Davis/SEMI Tel: 1.408.943.6937 E-mail: jdavis@semi.org |
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China Still Has Room to Grow in Fab Investment; No Risk of Overcapacity Speakers at SEMI Market Briefing Highlight Opportunities, Challenges |
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| SHANGHAI, China, March 17, 2004 -- China is not contributing to overcapacity
in semiconductor capital investment; to the contrary, there are still opportunities
for further investment to meet the growing domestic demand. That's according
to the head of China's leading silicon foundry, who spoke during a market
briefing seminar on the opening day of SEMICON China 2004 here today. Richard Chang, president and CEO of Semiconductor Manufacturing International Corp. (SMIC), addressed what he called “myths and misconceptions” regarding China's role in possible industry overcapacity. Even with the current aggressive expansion plans of SMIC and other wafer fabs in China, local wafer production will still fall far short of domestic demand, creating opportunitiesfor more players, according to Chang. By end of this year SMIC will have capacity for 125K wafer starts per month, representing only 5 to 6 percent of domestic supply, he said. In addition, 40 percent of the company's wafer output was for overseas-based customers. "This creates a lot of opportunity for Taiwan foundries and foundries in Singapore to come to China to supply the domestic demand," said Chang. The SMIC CEO pointed out that China's capital spending in 2004 ? estimated at $3.4 billion -- would be one third of the global capital spending by foundries. In addition, China’s capital spending as a percentage of sales was only 5.8 percent in 2003, compared to a global ratio average of about 25 percent. "China's capital spending plans are not the cause of possible oversupply," said Chang. One of the factors driving foundry growth in China is outsourcing of wafer production by integrated device makers (IDMs). IDM outsourcing will grow from $3.2 billion in 2001 to an estimated $6.5 billion in 2005, according to SMIC. Chang emphasized that the foundry business was adding to the income of the global IC industry, not displacing existing income. In the keynote address at the SEMICON China 2004 market briefing Zhang Qi of China's Ministry of Information Industry (MII) said during the past two decades China has encouraged the growth of the information industry as an accelerator for the overall economy. The information and electronics sector now accounts for about 44 percent of China's total exports. In terms of employment, the sector provides jobs for over four million people, up 11 percent from the previous year. Madam Qi also noted that China's IC industry made dramatic technology progress during 2003. "The gap between [China] and developed countries is narrowing," she said. Stan Myers, president and CEO of SEMI, presented the market outlook for equipment and materials. Citing new research conducted by SEMI in co-operation with the Semiconductor Equipment Association of Japan (SEAJ), he said the 2003 China market for new semiconductor equipment was worth just over $1.2 billion. This excluded used and refurbished equipment, which accounted for an additional 30 to 50 percent of that. In the area of IC plastic packaging materials, the China market was worth about $500 million last year, according to a new study by SEMI and TechSearch International. George Chamillard, chairman and CEO of Teradyne and chairman of the SEMI board of directors, discussed the increasing complexity of IC test equipment and the corresponding decline in average selling prices (ASPs). "The chips are stacked against us," he joked. During the downturn from 2001 to 2003 the IC test industry collectively invested $2.5 billion in R&D, equal to 30 percent of sales for that period. "Obviously this is unsustainable", said Chamillard. Nonetheless, he was confident that the suppliers of automatic test equipment would be able to continue lowering the cost of test by reducing equipment manufacturing costs. Chamillard also noted that China had now become a "broad-based player on the semiconductor table", in terms of technology and scale. David Wang, executive vice president of Applied Materials, discussed global semiconductor trends and noted that several factors were changing the nature of the chip industry. These included higher R&D cost and risk, leading to more alliances; increased technology content without average selling price leverage; price sensitive end markets; and increased outsourcing. To illustrate the increasing complexity of semiconductor manufacturing Wang cited data showing that in 1980 only 12 elements from the periodic table were used in IC fabrication. By 2000 that had grown to 60 elements. Regardless of the challenges, the future was bright for the semiconductor industry given that currently there were more than 1 billion users of digital devices, and that was expected to double in 5 years. Wang also highlighted the migration of wafer production to Asia. Out of every four wafers produced in the world today, two are from China and Taiwan. He predicted that within 10 years one out of every two wafers would be produced by chipmakers in China and Taiwan. About SEMI: SEMI is a global industry association for companies participating in the microelectronics and display industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Singapore, Tokyo, Shanghai and Washington, D.C. For more information, visit SEMI at www.semi.org. |
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SEMI ANNOUNCES CHINA SCHOLARSHIP FUND Association Supports Development of Regional Semiconductor Industry Through University Education Assistance |
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| SHANGHAI, China, March 16, 2004 - SEMI, a global industry association for
companies that provide technology and materials to manufacture semiconductors,
displays and other microelectronic products, has launched a scholarship
program to encourage Chinese university students to pursue careers in the
semiconductor industry. The SEMI China Scholarship Fund was conceived by
the SEMI China Advisory Board and will be administered by SEMI China. The fund, officially launched during SEMICON China 2004 here this week, aims to fund 40 to 50 individual scholarships per year, awarded to promising students at five major Chinese universities. "Through this program SEMI will further support the advancement of the local industry and assist deserving students," said Mark Ding, president of SEMI China. "Furthermore, contributing SEMI members will develop ongoing relationships with universities in China, which are a primary source of the talent needed to grow our companies." The scholarship fund was initiated with direction from the SEMI China Advisory Board, a committee made up of SEMI member companies and leading semiconductor manufacturers in China, tasked with guiding the association's activities in the region. "We believe that, under the auspices of SEMI, we can provide an important community and industry service," said Hock Chiang, a member of the SEMI China Advisory Board and managing director of Teradyne ATE, Shanghai office. "Through this collective effort of the SEMI members in China and other related programs with some of the major universities in the country, we aim to attract vital new talent to our industry. There are also many near term and long term benefits to participating members and I hope more members will sign up to grow this program." "In addition to assisting Chinese students, this scholarship fund augments the recruitment efforts of semiconductor companies by helping them to promote careers in their organizations to some of the most talented students in China. Its 'win - win' on all sides" said Rob Winter, general manager of BOC Edwards China. SEMI member companies that participate in the fund will also receive resumes of all the scholarship recipients to facilitate direct recruitment. In addition, a guest lecture program is planned to allow participating members to promote their companies to potential recruits at the selected universities. A survey of SEMI member companies is currently being conducted to determine which Chinese universities should be included in the scholarship fund. To contribute to the SEMI China Scholarship Fund or to receive further information, please contact Mark Ding at 86-21-5049-5688. SEMI is a global industry association for companies participating in the microelectronics and display industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Singapore, Tokyo, Shanghai and Washington, D.C. For more information, visit SEMI at www.semi.org. ASSOCIATION CONTACTS: Jonathan Davis/SEMI Tel: 408.943.6937 Email: jdavis@semi.org Mark Ding/SEMI China Tel: 86-21-5049-5688 Email: mding@semi.org |
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FPD CHINA 2004 SCHEDULED FOR AUGUST 11-13 New SEMI Exposition Devoted to China’s Growing FPD Manufacturing Sector |
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| Shanghai, China, March 16, 2004 - To serve the growing flat panel display
manufacturing industry in China SEMI has launched FPD China 2004, to be
held August 11-13 at the Kunshan Science & Culture Exhibition Center,
Kunshan, China. Serving executives and engineers in the FPD and related industries, the exposition will include product and technology exhibits, business and technical seminars and standards meetings. The expo is being held for the first time in China and is presented by SEMI and the China Electronic Chamber of Commerce (CECC). SEMI, a global trade association, has hosted the successful SEMICON China exposition since 1988. "FPD China 2004 is a showcase for technology innovation, applications and manufacturing solutions for a wide variety of flat panel displays," said Mark Ding, president of SEMI China. Global capital spending on TFT LCD manufacturing equipment is expected to reach a record $9.42 billion this year, a 43 percent increase over 2003, according to market research firm DisplaySearch. China’s FPD manufacturers, primarily investing in fifth generation TFT LCD fabs, will account for 11 percent of this amount, says DisplaySearch. Leading companies from around the world are expected to participate in FPD China 2004, displaying manufacturing equipment and services for TFT LCDs, organic light emitting diodes (OLEDs), plasma display panels (PDPs) and other types of flat panel displays. The show will also include exhibits by panel makers and suppliers of components such as LCD driver ICs. Companies interested in participating in the exposition should call Joyce Yang in the SEMI China office, 86.21.5049.588, or email jyang@semi.org. About SEMI: SEMI is a global industry association for companies participating in the microelectronics and display industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Singapore, Tokyo, Shanghai and Washington, D.C. For more information, visit SEMI at www.semi.org. ASSOCIATION CONTACTS: Jonathan Davis/SEMI Ph: 408.943.6937 E-mail: jdavis@semi.org Mark Ding/SEMI China Ph: 86.21.5049.5688 E-mail: mding@semi.org |
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CHINA SEMICONDUCTOR EQUIPMENT MARKET WORTH $1.16 BILLION IN 2003 SEMI, SEAJ Expand Coverage of Equipment Market Statistics Program |
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| SHANGHAI, China, March 16, 2004 - The market for new semiconductor equipment
in China reached $1.16 billion in 2003, according to data collected by
SEMI and the Semiconductor Equipment Association of Japan (SEAJ) for the
Worldwide Semiconductor Equipment Market Statistics (WWSEMS) program. The
monthly WWSEMS report, which will now include China as a new geographic
region, is produced by SEMI in cooperation with the SEAJ. 2003 China Market Data: New Semiconductor Capital Equipment Equipment
* Includes wafer manufacturing, mask/reticle and factory automation equipment **Includes assembly & packaging and test equipment WWSEMS data provides updated billings and bookings for 22 semiconductor equipment categories, including mask/reticle, etching, ion implant, CVD, CMP, sputtering, test, assembly and packaging. Market regions covered for each product sector include China, Europe, Japan, Korea, North America, Rest of World (ROW) and Taiwan. Previously China data was included under ROW. “SEMI and SEAJ are pleased to be able to provide detailed bookings and billing data for the China semiconductor equipment industry, which is one of the fastest growing semiconductor markets in the world,” said Stanley T. Myers, president and CEO of SEMI. In order to ensure the integrity and reliability of the data, SEMI and SEAJ have been collecting China booking and billings statistics on a monthly basis for the past year. More than 160 companies participate in the WWSEMS program, providing the industry’s most comprehensive data on semiconductor equipment bookings and billings. An annual subscription to the SEMI Equipment Market Data Service (EMDS), which includes the express book-to-bill report, the worldwide SEMS and bi-annual consensus forecast, costs $2,000 for SEMI corporate, associate and allied members, $4,000 for SEMI affiliate members and $5,000 for non-members. For subscription information visit the SEMI at www.semi.org or call SEMI customer service at +1.408.943.6900. SEMI is a global industry association for companies participating in the microelectronics and display industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Singapore, Tokyo, Shanghai and Washington, D.C. For more information, visit SEMI at www.semi.org. ASSOCIATION CONTACTS: Jonathan Davis/SEMI Tel: 408.943.6937 Email: jdavis@semi.org Dan Tracy/SEMI Tel: 408.943.7987 Email: dtracy@semi.org |
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半導体プラスチックパッケージング材料市場2008年に117億ドルに達する見通し ラミネート基板は20億ドルと評価され今後の成長をリード |
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| SEMI (Semiconductor Equipment and Materials International、本部：米国カリフォルニア州サンノゼ)
は、3月11日（米国時間）、SEMIとTechSearch Internationalの最新の調査によると、半導体パッケージング材料市場は2003年の79億ドルから2008年には117億ドルに拡大するであろう、と発表しました。半導体パッケージング材料市場の中で成長を牽引しているラミネート基板の市場は、2003年には全世界で20億ドル相当であり、2005年にはリードフレームを抜いて半導体パッケージング材料市場の最大のセグメントになると見られます。 「Global Semiconductor Packaging Materials Outlook （世界半導体パッケージング展望）」と題された本報告書では、ラミネート基板、フレックス回路／テープ基板、リードフレーム、ボンディングワイヤ、モールドコンパウンド、アンダーフィル材料、液体封止材料、ダイ接着剤、はんだボール、ウェーハレベルパッケージ用誘電材料を調査対象としています。 |
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この100ページの報告書は、パッケージングサブコントラクタ、半導体メーカー、材料メーカーへの140の綿密なインタビューに基づいています。本報告書には、各パッケージング材料それぞれについてのこれまで公表されていない売上高、出荷数量、市場シェアが含まれており、売上と出荷数量についての今後5年の予測(2003-2008)、平均販売価格と価格動向、地域市場動向分析が掲載されています。また、グリーン製造の影響も取り上げられています。 SEMI役員であるWadsworth-Pacific（ワーズワース パシフィック）社長のDuane Wadsworth （デュアン・ワーズワース）氏は次のように述べています。「この良く調査されたパッケージング材料分野の全貌についての展望は、画期的な必携の報告書です。」 この報告書はまた、サプライヤの機会のみならず、パッケージング材料市場を左右する重要な技術およびビジネス動向を明らかにしています。主な所見には次のようなものがあります。 ◎ 2004年には供給の逼迫によりワイヤーボンド基板の価格が上昇し、その結果として何社かのメーカー は生産力増強のための設備投資をすることになる。 ◎ QFNリードフレームパッケージの出荷数量は、2003年に前年比52%の成長をした。本報告書では、 この急速な成長は、既存のリードフレームベースの製造インフラが携帯電話のようなコンパクトな 電子機器の需要拡大に対応するために活用されることで、今後も継続すると述べている。 ◎ 最新パッケージングにおける新樹脂材料へのシフトは、モールドコンパウンド、アンダーフィルおよび 液体封止材メーカーに新たな機会を提供している。特に、フリップチップ組み立てプロセスにおける アンダーフィル材料の技術的制限が、新しい樹脂材料の開発をリードしてゆき、その新材料が市場 シェアを拡大する可能性がある。 なお、この報告書はSEMIから発売されており、価格は、SEMI会員価格が4,500ドル、一般価格が5,000ドルです。また、カンパニーワイドのサイトライセンスは12,500ドルです。 ■TechSearch International ： TechSearch International（米国テキサス州オースチン URL:www.techsearchinc.com）は、先端的なパッケージング技術および市場開発における的確でタイムリーな情報に基づいた技術ライセンスとコンサルティングを専門とする会社で、1987年に設立されました。 本件お問合せ先： ■メディア・コンタクト SEMIジャパン マーケティング部 E-Mail：jpress@semi.org、Tel: 03-3222-6020 ■統計内容について SEMIジャパン アドボカシー＆ニュー・テクノロジーズ部 安藤 洋一郎 E-Mail: yando@semi.org、Tel: 03-3222-5854 |
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SEMICON EUROPA RETURNS TO MUNICH 20-22 APRIL 2004 Expo Focuses on Semiconductor, FPD and MEMS Manufacturing Technologies |
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| Brussels, Belgium, March 12, 2004 -- More than 850 companies will display
the latest manufacturing technologies for semiconductors, flat panel displays
(FPDs)and micro-electromechanical systems (MEMS) at SEMICON Europa 2004,
to be held 20-22 April at the New Munich Trade Fair Center in Munich, Germany.
The exposition, now in its 28th year, is presented by SEMI, a global industry
trade association. In conjunction with the product exhibition, five days of technical conferences, business programs, international standards meetings and technical courses will run from 19-22 April at the Munich International Congress Center (ICM). The annual SEMICON Europa Fab Managers Forum will be held in Grenoble (France) on 23 April. “SEMICON Europa provides a platform for the exchange of ideas and the development of relationships that enable the expansion of business opportunities and advancements in semiconductor, FPD and MEMS manufacturing technologies,” said Walter Roessger, President, SEMI Europe. A new feature of the show this year will be the Intellectual Property Seminar on 22 April. The seminar, which will address business and legal aspects of IP, will gather together patent attorneys, researchers and business executives involved in semiconductor IP. Another new feature will be the Seminar “How to do business in China” on 21 April. MEMS technology will be highlighted during the one-day International MEMS/MST Forum on 19 April, focusing on opportunities and challenges in the production and commercialization of MEMS products. In addition, MEMS manufacturing technology will be featured in a special exhibit, the MEMS Manufacturing Technologies Pavilion, located in Hall B3. Automated handling systems, advanced tool or process control techniques for a total productivity will be the focus of several educational programs and standards task forces as well as of the new Factory Automation Pavilion, located on the Show Floor, where companies will present their solutions. The SEMICON Europa FPD Conference on 21-22 April will feature technical and business sessions on emerging display technologies such as OLEDs, FPD manufacturing strategies, and the global and European market outlook. The winner of the SEMI European Award will be announced on the first day of the exposition. The award recognizes outstanding contribution to the advancement of the semiconductor manufacturing industry in Europe. A highlight of the exposition is the Fab Managers Forum, which will take place in Grenoble, France, on 23 April. The event, now in its eighth year, provides a platform for wafer fab managers, executives and professionals to debate issues in semiconductor manufacturing. Other program highlights during the week of SEMICON Europa 2004 include the Sixth European Manufacturing Test Conference and the Advanced Packaging Conference, both on 19 April; the SEMInvest conference, also on 19 April; the SEMI market briefing on 20 April. SEMICON Europa also serves as the industry venue to advance semiconductor manufacturing standards. More than 45 SEMI International Standards events, including task force meetings, technical committee meetings and Standards Technical Education Programs (STEP) will be held during the week. MEMs-related standards will be addressed in five separate meetings. Pre-registration is not required for standards meetings, however attendees who wish to participate should contact Carlos Lee at SEMI Europe, email clee@semi.org, or call +32 (0) 22896497. SEMI is a global industry association for companies participating in the microelectronics and display industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Singapore, Tokyo, Shanghai and Washington, D.C. For more information, visit SEMI at www.semi.org. ASSOCIATION CONTACTS Vincent Dubois/SEMI Europe Tel: 32.2.289.6495 E-mail: vdubois@semi.org Jonathan Davis /SEMI Tel: 1.408.943.6937 E-mail: jdavis@semi.org |
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FIFTEENTH ANNUAL IEEE/SEMI ASMC SET FOR MAY 4-6, 2004 IN BOSTON Premier Conference Highlights Latest Developments in Semiconductor Manufacturing |
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| BOSTON, Mass., March 11, 2004 -- The 15th Annual IEEE/SEMI Advanced Semiconductor
Manufacturing Conference (ASMC 2004) will be held May 4-6 at the Seaport
Hotel in Boston, Massachusetts. ASMC 2004 is presented by SEMI, a global industry trade association, and the IEEE. The three-day conference is co-sponsored by the IEEE's Electron Devices Society (EDS), the IEEE Components, Packaging and Manufacturing Technology Society (CPMT), and MICRO Magazine. Corporate co-sponsors include Applied Materials, Bede Scientific, Fairchild Semiconductor and KLA Tencor. ASMC focuses on the latest technological developments in semiconductor manufacturing. Session topics include defect free processing, equipment productivity, advanced patterning and etch, yield enhancement methodologies, advanced process control, and materials handling and fab layout. Other sessions will focus on human resource management and MEMS technology. In addition to the technical sessions, three keynote speakers will highlight the major themes of the conference: Klaus Dieter Rinnen, managing vice president, Gartner Dataquest; Hans Stork, senior vice president, silicon technology development, Texas Instruments; and Thomas Sonderman, director, APC/AEC, Advanced Micro Devices. Early registration for ASMC 2004 closes April 20. To register or for more information visit www.semi.org/asmc or contact Margaret Kindling at mkindling@semi.org, phone 1.202.289.0440. Qualified journalists should contact Jennifer Blatt, SEMI Public Relations, atjblatt@semi.org for media registration information. SEMI is a global industry association for companies participating in the microelectronics and display industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Singapore, Tokyo, Shanghai and Washington, D.C. For more information, visit SEMI at www.semi.org. ASSOCIATION CONTACTS: Jonathan Davis/SEMI Tel: 408.943.6937 Email: jdavis@semi.org Margaret Kindling/SEMI Tel: 1.202.289.0440 Email: mkindling@semi.org |
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SEMICON China 2004 Expands in Shanghai |
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| Regions Largest Semiconductor Expo Features Expanded Product Exhibition
and More Extensive Technical Program Content SHANGHAI, China, February
25, 2004 -- SEMICON China 2004, the three-day exhibition and technical
symposium focusing on semiconductor and flat panel manufacturing technology
returns to the Shanghai New International Expo Center (SNIEC) in the heart
of the booming high-tech manufacturing center of Pudong on March 17-19,
2004. The expo is presented by SEMI and co-located with electronicaChina
and ProductronicaChina. SEMICON China, launched in 1988, is the largest and most comprehensive xhibition and technical conference in China dedicated to semiconductor manufacturing technology. Show organizers are anticipating record attendance levels this year due to general improvement in the global semiconductor market as well as an enlarged product exhibition area, improved technical programs, availability of online registration and a transportation program to provide shuttle busses from regional IC manufacturing areas to the convention center and subways throughout the duration of the expo. SEMICON China 2004 has expanded to an additional hall and will feature more than 765 companies from 24 countries occupying more than 1,260 booths in 11,350 square meters of exhibit space, making it the largest semiconductor-related exposition in China. In addition to three days of exhibits, SEMICON China 2004 features technical and market briefing programs focusing on the latest trends in semiconductor and flat panel display manufacturing. "We are very excited to provide a state-of-the-art technical program," said Mark Ding, president of SEMI China. "The SEMICON China Technology Symposium (STS) has been substantially improved this year with the oversight of a high-level program committee and careful selection of papers from numerous technical submissions. The STS, features high quality non-commercial technical papers and presentations at no cost to our industry attendees." The STS is organized under the direction of a SEMICON China Technical Program Committee, chaired by Dr. Tzu-Yin Chiu, VP Operation, Operation II, SMIC. The symposium offers a comprehensive technology overview in sessions on Lithography, Materials, Advanced Processing, Quality/ Reliability Control, Packaging Technology, Manufacturing Science, Flat Panel Display Technology. Other technical sessions include a packaging course on flip chip and WLCSP technologies for low cost high density packaging and PCB assemblies; and a chemical mechanical polishing technology session on recent advances in planarization technology for ULSI multi-level interconnection. SEMICON China also features a variety of programs focused on Flat Panel Display (FPD) technology. The FPD Tutorial provides and introduction to optoelectronic flat panel technology. The International Flat Panel Display Conference held jointly by MMI (MESSE Munchen International), iSuppli/Stanford Resources and SEMI is an overview of the global marketing and applications trends in FPD technologies. Also, The SEMICON China 2004 FPD Conference, part of the STS technical conference, features six technical presentations on advances in FPD manufacturing technology and a keynote address by Toshio Ohta, NEC LCD Technologies, Ltd. The SEMI Standards Workshop, cosponsored by the China Electronics Standardization Institute (CESI), provides a comprehensive overview of the SEMI International Standards Program. In addition, the workshop will feature presentations on local standards efforts by the General Research Institute for Non-Ferrous Metals (GRINM) and CESI. Additionally, there will be a SEMI Environmental, Health & Safety Standards Tutorial focused on using SEMI safety guidelines to control risks and costs of fab equipment and a half-day SEMI Standards Technical Education Program (STEP) on practical experiences with SEMI F47 (voltage sag immunity) and its relation to IEC standards. A free two-hour interactive workshop on Friday March 19 provides participants with an introduction to the SEMI MEMS Initiative. The SEMICON China 2003 PRC Market Briefing will also feature perspectives from representatives of China's Ministry of Information Industry (MII), Applied Materials, Teradyne, Semiconductor Manufacturing International Corporation (SMIC) and SEMI on the latest global industry trends, developments in China’s growing foundry businesses and technology advancements. The briefing is offered at no cost to attendees. Additional information regarding SEMICON China 2004 is available on the SEMI website at www.semi.org/semiconchina or by calling SEMI (in Shanghai) at +86.21.5049.5688. SEMI is an international industry association serving companies participating in the semiconductor and flat panel display equipment and materials markets. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, Seoul, Singapore, Tokyo, Shanghai and Washington, D.C. For more information, visit SEMI on the Internet at www.semi.org. ASSOCIATION CONTACTS: Michael Droeger/SEMI Ph: +1.408.943.6953 E-mail: mdroeger@semi.org Jonathan Davis/SEMI Ph: +1.408.943.6937 E-mail: jdavis@semi.org |
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NORTH AMERICAN SEMICONDUCTOR EQUIPMENT INDUSTRY POSTS JANUARY 2004 BOOK-TO-BILL RATIO OF 1.18 |
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| SAN JOSE, Calif., February 19, 2004 -- North American-based manufacturers
of semiconductor equipment posted $1.22 billion in orders in January 2004
(three-month average basis) and a book-to-bill ratio of 1.18, according
to the January 2004 Express Report published today by SEMI. A book-to-bill
of 1.18means that $118 worth of new orders were received for every $100
of product billed for the month. The three-month average of worldwide bookings in January 2004 was $1.22 billion. The bookings figure is four percent above the revised December 2003 level of $1.18 billion and 66 percent above the $739million in orders posted The three-month average of worldwide billings in January 2004 was $1.04 billion. The billings figure is eight percent above the revised December 2003 level of $963 million and 33 percent above the January 2003 billings level of $784 million. "Order levels for new semiconductor manufacturing equipment have improved significantly from a year ago," said Stanley Myers, president and CEO of SEMI. "SEMI members have seen six months of sequential improvement in total equipment orders and capital spending is expected to remain strong into 2004 as a broadbased industry recovery continues." The SEMI book-to-bill is a ratio of three-month moving average bookings to three-month moving average billings for the North American semiconductor equipment industry. Billings and bookings figures are in millions of U.S. dollars.
The data are contained in a monthly Express Report published by SEMI that tracks billings and orders worldwide of North American-based manufacturers of equipment used to manufacture semiconductor devices, not billings and orders of the chips themselves. The February 2004 Express Report is scheduled for publication on March 18, 2004 (subject to change). SEMI is a global industry association serving companies that develop and provide manufacturing technology and materials to the global semiconductor, flat panel display, MEMS and related microelectronics industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org. INDUSTRY/IR CONTACT: Dan Tracy, Ph.D./SEMI Tel: 1.408.943.7987 E-mail: dtracy@semi.org MEDIA CONTACT: Jonathan Davis/SEMI Tel: 1.408.943.6937 E-mail: jdavis@semi.org |
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SEMI、2003年のシリコンウェーハ出荷面積を発表 2003年のシリコンウェーハ需要は2年連続の二桁成長。販売高は5.5％の増加 |
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SEMI (Semiconductor Equipment and Materials International、本部：米国カリフォルニア州サンノゼ) は、2月17日（米国時間）、SEMI Silicon Manufacturers Group (SMG) による年末のシリコンウェーハ産業分析の結果によると、2003年の全世界シリコンウェーハ出荷面積は前年比10%増、また販売高は前年比5.5%増であった、と発表しました。 2003年の全世界シリコンウェーハ出荷面積は51億4,900万平方インチで、2002年の出荷面積46億8,100万平方インチを上回りました。販売高は、2002年の55億ドルから58億ドルに成長しました。 SEMI SMGのチェアマンで、MEMC Electronic Materials, Inc.のマーケティング担当副社長であるJohn Kaufmann (ジョン・カウフマン)氏は、次のように述べています。「シリコンウェーハ需要が加熱するにつれ、工場稼働率がタイトになってきました。300mm生産の上昇、コンシューマーエレクトロニクスのエンドマーケットの需要増大および米国経済の強化に支えられて、2004年には再び二桁成長が予測されています。」 シリコン産業年次動向
シリコンウェーハ出荷面積四半期毎動向
シリコンウェーハは半導体の基本材料であり、半導体は、コンピュータ、通信機器、家電をはじめとするあらゆるエレクトロニクス関連製品のきわめて重要な部品です。シリコンウェーハは、高度な技術で作られた薄い円盤状の素材で、様々な直径(1インチから300mmまで)で製造されており、殆どの半導体デバイス（チップ）の基板材料として使われています。 SMGは、SEMIの組織の中で独立したスペシャルインタレストグループとしてその役目を果たしており、リクレームウェーハを除く多結晶シリコン、単結晶シリコンおよびシリコンウェーハ（カット、鏡面、エピ等）の製造に携わっている全てのＳＥＭＩ会員企業に門戸を開いています。SMGの趣旨は、シリコン産業と半導体市場についての市場情報・統計データの収集を含め、シリコン産業に関する事項について集団的努力を促すことにあります。SMGに参画している企業の半導体用シリコン生産量の合計は、全世界の半導体用シリコン生産の95％以上に相当します。 本リリースで用いている数値は、ウェーハメーカーよりエンドユーザーに出荷されたバージンテストウェーハを含む鏡面ウェーハ、エピウェーハ、ノンポリッシュウェーハを集計したものです。 ･････････････････････････････････････････････････････････････････････････････････････…･… |
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半導体産業の環境・健康・安全における傑出した功績を称える 2004年 井上 晧 EHS賞の候補者推薦受付を開始（8月27日まで受付） |
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SEMI(Semiconductor Equipment and Materials International、本部：米国カリフォルニア州サンノゼ)は、2月17日（米国時間）、半導体産業の環境・健康・安全(Environmental, Health and Safety：EHS)における傑出した功績に対して授与される2004年 井上 晧(ｱｷﾗ) EHS賞の候補者の推薦受付を開始したことを発表いたしました。受付の締め切りは本年8月27日です。 井上 晧 EHS賞は、半導体産業および社会に対して、EHS分野での傑出した功績が認められた産業界および学界の個人に対して授与されます。業界におけるEHS活動において卓越したリーダーシップを示した個人、またはEHS成績を向上させる革新的なプロセス、製品、材料を開発した個人が対象となります。SEMIのEHS Executive Committeeの選考委員会が、全ての候補者を調査します。 これまでの受賞者は次の方々です。 井上 晧EHS賞は、SEMIのEHS Divisionが主催しています。候補者の推薦は、SEMI EHS WEBサイト（http://www.semi.org/ehs）を通じて申請することができます。 詳細は、SEMIジャパン アドボカシー＆ニュー・テクノロジーズ部 安藤 洋一郎 （電話：03-3222-5854、E-mail：yando@semi.org） または、SEMI EHS Division Rick Row （電話：+1-408-943-6957、E-mail：rrow@semi.org）までお問合わせ下さい。 ･････････････････････････････････････････････････････････････････････････････････････…･… メディア・コンタクト：マーケティング部 |
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NORTH AMERICAN SEMICONDUCTOR EQUIPMENT INDUSTRY POSTS DECEMBER 2003 BOOK-TO-BILL RATIO OF 1.20 |
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| SAN JOSE, Calif., January 20, 2004 -- North
American-based manufacturers of semiconductor equipment posted $1.1 billion in orders in December
2003 (three-month average basis) and a
book-to-bill ratio of 1.20, according to the December 2003 Express Report published today by SEMI. A book-to-bill of
1.20 means that $120 worth of new orders
were received for every $100 of product billed for the month. The three-month average of worldwide bookings in December 2003 was $1.1 billion. The bookings figure is 19 percent above the revised November 2003 level of $923 million and 33 percent above the $827 million in orders posted in December 2002. The three-month average of worldwide billings in December 2003 was $918 million. The billings figure is five percent above the revised November 2003 level of $876 million and five percent above the December 2002 billings level of $878 million. "The December data support the positive outlook for strong growth in semiconductor capital investment this year," said Stanley Myers, president and CEO of SEMI. "Analysts presenting at the SEMI Industry Strategy Symposium this month were in agreement that 2004 is shaping up to be a double-digit growth year for the global semiconductor equipment industry." The SEMI book-to-bill is a ratio of three-month moving average bookings to three-month moving average billings for the North American semiconductor equipment industry. Billings and bookings figures are in millions of U.S. dollars.
The data contained in this release was compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. can assume no responsibility for the accuracy of the underlying data. The data are contained in a monthly Express Report published by SEMI that tracks billings and orders worldwide of North American-based manufacturers of equipment used to manufacture semiconductor devices, not billings and orders of the chips themselves. Please note that the January 2004 Express Report, previously scheduled for publication on February 18, is currently scheduled distribution on February 19, 2004 (subject to change). Please consult the “News and Resources” page at www.semi.org for additional updates. SEMI is a global industry association serving more than 2,500 companies that develop and provide manufacturing technology and materials to the global semiconductor, flat panel display, MEMS and related microelectronics industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org. INDUSTRY/IR CONTACT: Dan Tracy, Ph.D./SEMI Tel: 1.408.943.7987 E-mail: dtracy@semi.org MEDIA CONTACT: Jonathan Davis/SEMI Tel: 1.408.943.6937 E-mail: jdavis@semi.org |
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ANNUAL SEMI BOB GRAHAM AWARD PRESENTED TO EDWARD BRAUN OF VEECO INSTRUMENTS Award Recognizes Outstanding Contributions to Marketing Within the Semiconductor Equipment and Materials Industry |
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| PEBBLE BEACH, Calif., January 12, 2004 -- Semiconductor Equipment and Materials
International (SEMI) today presented the fifth-annual Bob Graham Award
for outstanding contributions in semiconductor equipment and materials
marketing to Edward H. Braun, chairman and CEO of Veeco Instruments Inc.
The award was presented at the SEMI Industry Strategy Symposium (ISS) here
at the Inn at Spanish Bay. Braun was recognized for successfully developing products and alliances across multiple markets. This strategy helped offset high R&D costs for specific technologies and minimized the effects of the silicon cycles on small semiconductor equipment companies. “Ed Braun established and executed one of the equipment industries most successful strategies to develop a product portfolio that combines metrology and process equipment and extends those products and technologies to multiple markets,” said Stanley T. Myers, president and CEO of SEMI. “This ultimately provided a broader range of customers with affordable access to these important technologies.” Braun has been a director, chairman and CEO of Veeco Instruments since January 1990, when he led a management buy-out of the firm. That was followed by an initial public offering in 1994. Veeco has grown through internal product development and a dozen acquisitions from $30 million in revenues to over $300 million per year. Prior to 1990, Braun was employed as the executive vice president and chief operating officer of Veeco Instruments Inc (now Lambda Electronics Inc), the company from which Veeco acquired its business operations. Braun joined the Veeco predecessor in 1966 as a regional sales engineer and held numerous positions with the organization, including director of marketing, director of operations and general manager. Braun is a member of the SEMI board of directors and served a term as SEMI chairman of the board in 1993. The Bob Graham Award was established to honor individuals who have made outstanding contributions to customers through the creation and/or implementation of marketing programs that enhance customer satisfaction and further the growth of the semiconductor equipment and materials industry. The award is named in honor of the late Bob Graham, the distinguished semiconductor industry leader who was part of the founding team of Intel and who helped establish industry-leading companies Applied Materials and Novellus Systems. Eligible candidates are nominated by their industry peers and are selected by an award committee, which is comprised of members of the Sales and Marketing Executive Council of SEMI (SMECS). Previous recipients include Art Zafiropoulo (2000), Jim Healy and Barry Rapozo (2001), Jerry Hutcheson and Ed Segal (2002) and Steve “Shigeru” Nakayama (2003). Based in San Jose, Calif., SEMI is an international trade association serving companies participating in the semiconductor and flat panel display equipment and materials markets. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit SEMI on the Internet at www.semi.org. ASSOCIATION CONTACTS: Jonathan Davis/SEMI Ph: 408.943.6937 E-mail: jdavis@semi.org |
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「ISS Japan 2004」開催、2004年2月5日（木）－6日（金）、横浜にて “世界の期待を担う日本半導体産業を目指して” |
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SEMI（Semiconductor Equipment and Materials International）は、2004年2月5日（木）-6日（金）の2日間にわたり、神奈川県横浜市のパン パシフィック ホテル横浜にて、第18回「ISS（Industry Strategy Symposium） Japan 2004」を開催します。 「ISS
Japan」は、半導体およびフラットパネルディスプレイ産業のビジネス戦略を、市場予測、経営戦略、技術動向、国際関係などの観点から議論する経営戦略シンポジウムです。昨年2月に開催された「ISS
Japan
2003」には、業界のエグゼクティブ204名が参加しました。 本年のISS Japanでは、初日5日のキーノートスピーチに独立行政法人産業技術総合研究所 理事長の吉川
弘之氏をお迎えし、「新しい産学協力」と題してご講演いただきます。 ISS Japanは、「パネルディスカッション」と「ワークショップ」を通じて、参加者（聴講者）もディスカッションに参画いただく事を特徴としています。パネルディスカッションでは、財団法人機械振興協会経済研究所 調査研究部 研究主幹 井上 弘基氏の司会により、「大再編時代の半導体ビジネスとビジネス基盤 －統合／特化、競合／連携の新ミックス－」をテーマに、転換点を迎えた半導体産業の方向性について議論が展開されます。また、パネルディスカッションに引き続いて行うワークショップでは、本シンポジウムの全講演を踏まえて、少人数のグループに分かれて自由に議論して頂きます。 なお、ISS Japan 2004への参加申込みは、「ISS Japan
2004」WEBサイトで受付中です。 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 「ISS Japan 2004」 開催概要 ●プログラム概要：
･･･････････････････････････････････････････････････････････････････････････････････ 本リリースへのお問合せ |
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SEMICON KOREA RETURNS TO SEOUL IN FEBRUARY Programs Include Seminars Focusing On FPDs and Nanotechnology |
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| SEOUL, Korea, December 30, 2003 -- SEMICON Korea, the largest exposition
dedicated to semiconductor and flat panel display manufacturing in Korea,
will return to the Convention and Exhibition Center (COEX) in Seoul, February
18-20, 2004. The exposition is presented by SEMI. SEMICON Korea 2004 will feature about 500 exhibiting companies occupying approximately 920 booths, showcasing the latest equipment, materials and services for the production of 300 mm silicon wafers, nanotechnology devices and FPD products. Spending on total semiconductor capital equipment in Korea will reach $2.8 billion in 2003, up more than 70 percent from 2002, according to the recently released SEMI year-end consensus forecast. Korea is the third largest capital spending region (following the U.S. and Japan) and will account for about 15 percent of worldwide semiconductor manufacturing technology spending in 2003. "The growth in semiconductor and FPD capital spending in Korea and the upturn in the global device market are excellent signs ahead of SEMICON Korea 2004," said Joo Hoon Lee, president of SEMI Korea. In addition to the show floor exhibits, the exposition features three-days of technical and business programs. The SEMICON Korea STS (SEMI Technical Symposium), February 18-19, will include technical sessions on advanced lithography, dielectrics, metals, new materials and their processes, device technology, etching technology, contamination-free manufacturing and packaging technology. A plenary talk on "The future of the semiconductor industry" will be given by Choong-Ki Kim,Professor, KAIST, on Wednesday, Feb. 18, in the COEX Grand Ballroom. The business programs include a semiconductor market briefing and a nanotechnology seminar (both on February 18.) Three special FPD related programs are scheduled, an FPD market seminar on Feb. 19, LCD backlight unit standards and technologies seminar on Feb. 19 and an FPD tutorial on LCD, OLED and PDP technologies on Feb. 19-20. For registration and detailed program information, please visit the SEMI Korea website at www.semi.org/semiconkorea. Or call SEMI for more information. In the U.S., call 408.943.6905; in Korea, dial 82.2.551.3401. Qualified journalists wishing to attend SEMICON Korea 2004 should contact (in the U.S.) Jennifer Blatt, SEMI Public Relations, at +1.408.943.7988 or jblatt@semi.org. In Korea, contact Min-Jung Kang at 82.2.551.3404 or mkang@semi.org. About SEMI Based in Seoul, SEMI Korea is the regional office of SEMI, a global industry association serving companies participating in the semiconductor and FPD equipment and materials markets. SEMI also maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit SEMI at www.semi.org |
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