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‚Q‚O‚Q‚U”N‚QŒŽ‚Q‚T“ú�X�V

 
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Company Location Products Remarks
S (Š”)SUMCO “ú–{ ƒEƒGƒn IR
  �@SUMCO TECHXIV(Š”) “ú–{ ƒEƒGƒn IR
‚³ ƒZ�[ƒŒƒ“KST(Š”) “ú–{ �»•iƒT�[ƒrƒX
�M‰z‰»Šw�H‹Æ(Š”) “ú–{ ƒEƒGƒn IR
�@�M‰z”¼“±‘Ì(Š”)/”’‰Í�H�ê “ú–{ ƒEƒGƒn IR
  �@’¼�]’ÓdŽq�H‹Æ(Š”) “ú–{ ƒEƒGƒn
  �@’·–ì“dŽq�H‹Æ(Š”) “ú–{ ƒEƒGƒn
  �@ŽO‰v”¼“±‘Ì�H‹Æ(Š”) “ú–{ ƒEƒGƒn
�Z—F‰»Šw(Š”)/‰»�‡•¨”¼“±‘Ì�Þ—¿�E”––Œ�Þ—¿ “ú–{ SCIOCS
‚Ü (Š”)�¼�è�»�ì�Š “ú–{ ƒEƒGƒn  
‚í (Š”)ƒ�ƒJƒeƒbƒN “ú–{ ƒEƒGƒn  
Company Location Products Remarks
G GlobalWafers Co., Ltd. ‘ä˜p Product IR
  GlobalWafers Co., Ltd. ‘ä˜p Product
  �@ƒOƒ��[ƒoƒ‹ƒEƒF�[ƒnƒY�EƒWƒƒƒpƒ“(Š”) “ú–{ Product IR
  �@�@ƒGƒ€�EƒC�[�EƒGƒ€�EƒV�[(Š”) “ú–{ Product
E Episil-precision inc. ‘ä˜p EPI IR
SICC Co., Ltd. ’†�‘ SiC
  �@SICC GLOBAL(Š”)      
S Siltronic AG ƒhƒCƒc Product IR
SK siltron Co.,Ltd. ŠØ�‘ Product IR
  �@SK Gloup ŠØ�‘    
  Soitec SA ƒtƒ‰ƒ“ƒX Product IR
  �@ƒ\ƒCƒeƒbƒN      
W Wafer Works Corp. ‘ä˜p Product IR
�@ƒEƒF�[ƒnƒ��[ƒNƒX
  ƒtƒHƒgƒŒƒWƒXƒg      
  Company Location Products IR
J JSR(Š”) ‹’“_ˆê—— ”¼“±‘Ì�Þ—¿  
‚³ �M‰z‰»Šw�H‹Æ(Š”) ‹’“_ˆê—— ƒtƒHƒgƒŒƒWƒXƒg  
  �Z—F‰»Šw(Š”) ‹’“_ˆê—— ƒtƒHƒgƒŒƒWƒXƒg  
‚½ “Œ‹ž‰ž‰»�H‹Æ(Š”) ‹’“_ˆê—— ƒtƒHƒgƒŒƒWƒXƒg  
‚È ƒiƒKƒZƒPƒ€ƒeƒbƒNƒX(Š”) ‹’“_ˆê—— ƒtƒHƒgƒŒƒWƒXƒg  
  “úŽY‰»Šw�H‹Æ(Š”) ‹’“_ˆê—— ARC  
  “ú–{ƒ[ƒIƒ“(Š”) ‹’“_ˆê—— ƒtƒHƒgƒŒƒWƒXƒg  
‚Í •xŽmƒtƒCƒ‹ƒ€ƒGƒŒƒNƒgƒ�ƒjƒNƒXƒ}ƒeƒŠƒAƒ‹ƒY(Š”) ‹’“_ˆê—— ƒtƒHƒgƒŒƒWƒXƒg  
  Company Location Products IR
C Cornerstone Technologies Company ’†�‘ Products
D DisChem, Inc. •Ä�‘ Products  
I Integrated Micro Materials •Ä�‘ Products  
Irresistible Materials Ltd.New ‰p�‘ Products
P Prolyx Microelectronics Pvt. Ltd. ƒCƒ“ƒh Products  
D Dongjin Semichem Co., Ltd. ŠØ�‘ Photoresist  
A Allresist GmbH ƒhƒCƒc Products  
M Microchemicals GmbH ƒhƒCƒc Products  
R Rongda/—e‘労Œõ/
ShenZhen Rongda Photosensitive Science & Technology Co., Ltd.
’†�‘ Products  
  ƒtƒHƒgƒŒƒWƒXƒg�Þ      
  Company Location Products IR
A (Š”)ADEKA ‹’“_ˆê—— “Y‰Á�Ü  
‚  ‘å�ã—L‹@‰»Šw�H‹Æ(Š”) ‹’“_ˆê—— ”¼“±‘Ì�Þ—¿  
‚½ “c‰ª‰»Šw�H‹Æ(Š”) ‹’“_ˆê—— ƒŒƒWƒXƒgŒ´—¿  
“Œ—m�‡�¬�H‹Æ(Š”) ‹’“_ˆê—— �Þ—¿  
  ƒ_ƒCƒh�[ƒPƒ~ƒbƒNƒX(Š”) ‹’“_ˆê—— “dŽq�Þ—¿  
CMPƒXƒ‰ƒŠ�[  
Company Location Products  
A AGC(Š”) ‹’“_ˆê—— CMPƒXƒ‰ƒŠ�[  
J JSR(Š”) ‹’“_ˆê—— CMPƒXƒ‰ƒŠ�[  
‚È ƒjƒbƒ^�Eƒfƒ…ƒ|ƒ“(Š”) ‹’“_ˆê—— CMPƒXƒ‰ƒŠ�[  
“ú–{ƒCƒ“ƒeƒOƒŠƒX(�‡) ‹’“_ˆê—— “dŽq�Þ—¿  
  �@Entegris, Inc. ƒAƒ�ƒŠƒJ    
‚Í •xŽmƒtƒCƒ‹ƒ€(Š”) ‹’“_ˆê—— CMPƒXƒ‰ƒŠ�[  
  (Š”)ƒtƒWƒ~ƒCƒ“ƒR�[ƒ|ƒŒ�[ƒeƒbƒh ‹’“_ˆê—— CMPƒXƒ‰ƒŠ�[  
  (Š”)ƒŒƒ]ƒiƒbƒN ‹’“_ˆê—— CMPƒXƒ‰ƒŠ�[  
  Company Location Products IR
D DuPont •Ä�‘ CMP slurries  
  “ÁŽêƒKƒX      
  Company Location Products  
  ŠÖ“Œ“d‰»�H‹Æ(Š”) ‹’“_ˆê—— “ÁŽêƒKƒX IR
  (Š”)ƒŒƒ]ƒiƒbƒN ‹’“_ˆê—— ”¼“±‘Ì IR
F Foosung Co Ltd. ŠØ�‘ Gas  
  SK specialty ŠØ�‘   IR
  SK specialty Japan(Š”) ‹’“_ “ÁŽêƒKƒX  
M Merck ƒhƒCƒc ”¼“±‘Ì  
  “dŽq�Þ—¿      
  Company Location Products IR
A artience(Š”) ‹’“_ˆê—— “dŽq�Þ—¿
K KHƒlƒIƒPƒ€(Š”) ‹’“_ˆê—— “dŽq�Þ—¿
‚© ŠÖ“Œ‰»Šw(Š”) ‹’“_ˆê—— “dŽq�Þ—¿  
‚³ �Z—F‰»Šw(Š”) ‹’“_ˆê—— “dŽq�Þ—¿
‚½ “c’†‹M‹à‘®ƒOƒ‹�[ƒv ‹’“_ˆê—— �»•i�î•ñ  
  “Œ–M‰»Šw�H‹Æ(Š”) ‹’“_ˆê—— �»•i�î•ñ IR
�@ (Š”)ƒgƒNƒ„ƒ} ‹’“_ˆê—— “dŽq�Þ—¿  
  (Š”)ƒgƒŠƒPƒ~ƒJƒ‹Œ¤‹†�Š ‹’“_ˆê—— �»•i�î•ñ IR
‚È ƒiƒ~ƒbƒNƒX(Š”) ‹’“_ˆê—— �»•i�î•ñ
“ú“SƒPƒ~ƒJƒ‹�•ƒ}ƒeƒŠƒAƒ‹(Š”) ‹’“_ˆê—— �»•i�î•ñ  
“ú“Sƒ}ƒCƒNƒ�ƒ�ƒ^ƒ‹(Š”) ‹’“_ˆê—— �»•i�î•ñ
‚Í ƒnƒŠƒ}‰»�¬ƒOƒ‹�[ƒv(Š”) ‹’“_ˆê—— “dŽq�Þ—¿  
‚Ü ƒ�ƒbƒN(Š”) ‹’“_ˆê—— “dŽqŠî”Â
ƒ�ƒ‹ƒeƒbƒNƒX(Š”) ‹’“_ˆê—— �»•i�î•ñ
  Company Location Products IR
D DuPont •Ä�‘ Products  
E ENF Technology Co., Ltd. ŠØ�‘ Products  
M MTI ECO INNO. ŠØ�‘ Products  
T SUNFAR/“‚ŽRŽO›t“dŽq�Þ—¿
Tangshan Sunfar Silicon Industries Co., Ltd.
’†�‘ Products  
2022/6/19/�§’è